Anisotropic Conductive Adhesive Curing for Terminal Spacing
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Solution Overview
Problem
Existing methods for mounting electronic components using anisotropic conductive films face challenges with temperature-induced warping and alignment issues due to abrupt temperature increases when using infrared laser light, limiting the allowable spacing between terminals.
Innovation Solution
The method involves thermally pressurizing conductive particles between terminal rows and fully curing an anisotropic conductive adhesive using infrared laser light, allowing for increased spacing between terminals and low-temperature mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If infrared laser light is used to melt or cure the anisotropic conductive film, then the film is cured effectively, but the temperature of the film abruptly increases, limiting the allowable spacing between terminals
Solution Approach 1:
The curing process is divided into two distinct stages: first, infrared laser light is used to melt the binder and enable particle flow; second, UV light is used to cure the photopolymerization-type binder. This segmentation allows each light source to perform its optimal function without causing excessive temperature increase, as UV curing occurs at lower temperatures compared to complete thermal curing.
Solution Approach 2:
The patent introduces a dual-light-source system where infrared light acts as an intermediary to prepare the adhesive by melting the binder, creating conditions for particle sandwiching, and then UV light serves as the final curing agent. This intermediary approach allows the process to benefit from both thermal melting and photopolymerization curing mechanisms.
2Manufacturing precision
If the temperature is kept low for mounting, then warping and alignment shifting are suppressed, but the anisotropic conductive film cannot be properly cured
Solution Approach 1:
The patent changes the parameter of curing mechanism from purely thermal to photopolymerization-based. By using UV light irradiation instead of continued heating, the adhesive can be cured at lower temperatures that prevent warping and alignment shifting while still achieving complete curing through photochemical reactions rather than thermal processes.
Solution Approach 2:
The patent replaces the thermal curing mechanism with a photopolymerization mechanism. Instead of relying on heat to cure the adhesive (which causes warping), UV light is used to initiate polymerization reactions, substituting a thermal-mechanical process with an optical-chemical process that occurs at lower temperatures.
3Productivity
If the spacing between terminals is reduced, then component density increases, but the allowable range for spacing decreases when using traditional curing methods
Solution Approach 1:
The patent changes the curing parameter from thermal to photopolymerization, enabling effective curing at lower temperatures. This allows the use of lower-viscosity binders that can flow more easily into smaller spacing gaps between terminals, thereby increasing component density while maintaining curing effectiveness across a wider range of spacing configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively increases the allowable spacing between terminals while maintaining low-temperature mounting, improving conduction resistance and reducing alignment difficulties.
Implementation Method 1
heating an anisotropic conductive film by using infrared laser light to melt or soften the anisotropic conductive film
Implementation Method 2
a thermal pressurization step of thermally pressurizing the first electronic component and the second electronic component to sandwich the conductive particles between the first terminal row and the second terminal row
Implementation Method 3
a full curing step of irradiating with infrared laser light to fully cure the anisotropic conductive adhesive
Data Source
AI summary
A method for manufacturing a connection structure capable of increasing the allowable range of a spacing between terminals of a component and mounting at a low temperature. The method for manufacturing a connection structure includes a disposition step of disposing, through an anisotropic conductive adhesive of a thermosetting type including conductive particles, a first electronic component including a first terminal row and a second electronic component including a second terminal row facing the first terminal row, a thermal pressurization step of thermally pressurizing the first electronic component and the second electronic component to sandwich the conductive particles between the first terminal row and the second terminal row, and a full curing step of irradiating with infrared laser light to fully cure the anisotropic conductive adhesive in a state where the conductive particles are sandwiched between the first terminal row and the second terminal row.