Printed Circuit Assembling TRIZ Cases

Flexible orthogonal connectors join circuit boards at variable angles, eliminating bulky cables and reducing insertion force damage.

Infrared laser curing with thermal pressurization increases allowable terminal spacing while suppressing temperature-induced warping.

Hybrid jetting creates interdigitated sensor arrays with precise electrode spacing, resolving manufacturing cost and precision trade-offs for mass production.

Silver-coated copper powder solder paste delays tin-copper reactions to prevent oxidation and reduce void generation in solder layers.

A tape feeder detects cover tape tension to verify component supply state after power restoration.

A folded flexible circuit connects conductive pads to non-parallel substrate edges.

A coating film on PCB connection portions prevents solder loss to the bath, ensuring uniform electrode adhesion and reliable joint strength.

Segmented insulating and supporting substrates allow compact housing while maintaining structural integrity during bending.

Dynamic exposure time adjustment captures unsaturated pixel data from bright solder and dark background regions, reducing measurement time by 11%.

Hot-melt protective layers reinforce flexible circuit boards carrying driving chips, preventing pin breakage during rigid substrate separation.

A flexible printed circuit board with protrusions connects to actuator electrodes via bonding parts that maintain contact pressure.

Vertical stacking of compression-molded circuit boards reduces camera module thickness while maintaining high pixel density and image quality.

A printed circuit board design separates ground patterns into exposed connection areas and insulated wiring sections to stabilize soldering.

Segmented solder resist openings allow underfill contact that relieves humidity pressure, preventing solder loss and improving reliability.

Integrating bottom pins into the inductor reduces converter volume by eliminating through-hole requirements.

Segmented adhesive application prevents premature curing from squeeze connector heat, reducing material waste in flexible circuit manufacturing.

Segmented support portions dynamically adjust to counteract bending forces, ensuring stable processing of thin semiconductor substrates.

An anisotropic conductive fabric woven with conductive and insulative fibers electrically couples semiconductor bumps to substrate pads.

Segmented flexible printed circuit boards use C-shaped cutouts to match rigid board dimensions, reducing material wastage during assembly.

Varying the conductive resin layer thickness channels moisture gas to an external gap, reducing internal stress and preventing electrode peeling.

Isotropic pressure fixes multiple semiconductor devices to an unhardened resin layer, preventing bonding defects caused by sequential processing.

A multi-layer wiring board uses interlayer grooves filled with elastic materials to absorb mechanical impact energy.

Widened cavity sections store solder before reflow, resolving uneven distribution and component height issues.

Target windows with larger contours enable machine vision positioning for circuit board layer build-up.

Apparatus determines component mounting positions using optical measurement data to optimize alignment accuracy.

Conductive posts with solder caps expand contact area to resolve limited binding force between packaging and connecting substrates.

Metal plating and solder cream fill via holes to boost conductor density, eliminating voids that degrade connection reliability.

Asymmetric electrode design prevents component toppling and short circuits while maintaining high capacitance in multilayer ceramic electronic parts.

Nesting the conductive spring within the movable member cavity prevents disengagement during reflow soldering while maintaining stable electrical connections.

Shared vias connect alternating solder-including electrodes on a packaging substrate, reducing voltage drops caused by wiring resistance.

A neuromodulation mouthpiece delivers subcutaneous electrical stimulation to the tongue via embedded electrodes.

Segmented thin units with tapered fronts reduce contact resistance without increasing press-fitting force.

A corrugated multi-layer microwave printed circuit board uses segmented adhesive bonding to reduce assembly weight.

Geometric modeling identifies wire numbers to resolve assembly errors in confined spaces.

Adjustable mounting bracket with movable fasteners on flanges accommodates diverse CPU socket spacings.

A coil-type electronic component uses soft magnetic alloy grains bonded by a self-formed oxide layer to achieve high saturation magnetic flux density.

Segmented carrier boards with parallel testing wires identify defective LEDs early, preventing total package waste and boosting manufacturing efficiency.

A pad-on-via wiring circuit board design places the pad portion on the insulating layer surface to ensure flatness.

A component mounting system calculates a feeder evaluation value by summing suction position correction values and shift amounts to maintain production efficiency.

Segmented stepped lids join ceramic substrates via solder, preventing flux scattering and short circuits.

Via hole shape variation eliminates pad layers and stud bumps, reducing production costs and board thickness while lowering power supply line resistance.

Absorbing material integrated into a PCB connector housing absorbs electrical signals via dielectric loss.

A multilayer flexible printed circuit board manufacturing method uses binder layer slits to establish electrical connections between copper clad laminates.

Cover members prevent dielectric incursion onto conductors during lamination, ensuring reliable electrical connections for PCB edge connectors.

Hybrid bus bar connections resist vehicle vibrations by combining soldered electrical paths with screwed mechanical anchors for reliable power distribution.

Permanent magnets in the connection device lose attraction at high temperatures, passively disconnecting failing accumulators to prevent thermal propagation.

Alignment marks guide bumps to position electronic components within printed wiring boards.

A dispensing system orients a unit relative to an object using a single fiducial and vision data for precise material deposition.

Polymer tape fixes flexible substrates on holders for precise lithography alignment.