Semiconductor Clamping Apparatus with Segmented Support Plate

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Solution Overview

Problem

Semiconductor substrates are prone to bending and warping during fabrication processes due to their thin and broad nature, necessitating a clamping apparatus that can effectively prevent or minimize distortion.

Innovation Solution

A clamping apparatus comprising a main body with a vertically movable support plate, a fixed gripper, and a horizontally movable gripper, which includes buffering units to absorb physical and chemical forces, ensuring secure clamping and protection of the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If semiconductor substrates are made thinner and broader to increase processing capacity, then productivity is improved, but the substrates become more prone to bending and warping during processing

Engineering Contradiction:

Improveprocessing capacityVSAvoidsubstrate flatness

Core Design Contradiction:

ProductivityVSStability of the object's composition

Solution Approach 1:

The support plate is divided into multiple independently movable support portions (first, second, third support portions) that can be controlled separately. This segmentation allows precise local adjustment of substrate support, counteracting bending and warping forces while maintaining overall substrate stability during processing

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support plate incorporates movable support portions that can dynamically adjust their positions and heights. The first support portion moves in a first direction, the second support portion moves in a second direction, and the third support portion moves in a third direction, enabling real-time adaptation to substrate deformation and maintaining substrate flatness throughout the processing cycle

Inventive Principle:

Principle #15Dynamics

2Stability of the object's composition

If a clamping apparatus is designed to securely clamp substrates to prevent bending, then substrate stability is improved, but the complexity of the apparatus increases

Engineering Contradiction:

Improvesubstrate flatnessVSAvoidapparatus structure

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

Multiple support functions are merged into a single integrated support plate structure. The first, second, and third support portions are combined in one plate, each with its own movement capability. This merging provides comprehensive substrate support and stabilization while avoiding the need for multiple separate clamping devices, thus managing complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The support plate serves multiple functions simultaneously: it supports the substrate from below, prevents bending through distributed support, and enables substrate handling. The movable support portions provide both mechanical support and active correction of substrate deformation, making the apparatus versatile for different substrate sizes and processing requirements

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS8316531B2Semiconductor device fabrication process

Publication Date: 2012.11.27 SAMSUNG ELECTRONICS CO LTD

AI summary

A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.