Built-in Electronic Component Alignment on Printed Wiring Boards
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Solution Overview
Problem
High integration of circuit components on printed wiring boards requires accurate positioning of built-in electronic components for enhanced connection reliability, which is challenging due to the complexity of achieving precise alignment.
Innovation Solution
A method involving the formation of alignment marks on metal foils, where bumps are created based on these marks to accurately position electronic components, and an insulation layer is formed over the components to ensure reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electronic components are built-in to increase integration density, then the degree of integration is improved, but positioning accuracy deteriorates
Solution Approach 1:
Alignment marks are formed on the metal foil before the electronic component is mounted. This preliminary marking enables accurate positioning to be established in advance, allowing the component to be precisely located during the built-in process despite the challenges of high integration density
Solution Approach 2:
Alignment marks serve as an intermediary reference between the metal foil and the electronic component. These marks facilitate the alignment process by providing visible registration points that guide the positioning of fine-pitched solder bumps and components, resolving the positioning accuracy issue without compromising integration density
2Manufacturing precision
If alignment marks are formed on metal foil, then positioning accuracy is improved, but device complexity increases
Solution Approach 1:
The alignment mark formation process is segmented into distinct steps: forming marks on the metal foil, using these marks to position bumps, and then using both to align the electronic component. This segmentation simplifies the overall alignment process by breaking it into manageable stages with clear reference points at each step
Data Source
AI summary
A method for manufacturing a printed wiring board, including forming an alignment mark in a metal foil, forming a bump on the metal foil at a position determined based on the alignment mark, positioning an electronic component over the metal foil, the positioning comprising aligning a terminal of the electronic component with the bump based on the alignment mark, connecting the terminal of the electronic component with the bump, forming an insulation layer enclosing the electronic component connected with the bump such that the electronic component is placed inside a printed wiring board, and patterning the metal foil to which the electronic component is connected through the bump.