Embedded Circuit Board Via Hole Shape Optimization
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Solution Overview
Problem
Existing circuit boards with embedded semiconductor ICs face challenges in reducing thickness and lowering production costs while maintaining high performance, due to the need for stud bumps and transition layers which increase costs and hinder thinness and performance optimization.
Innovation Solution
A circuit board design featuring a resin substrate with via holes of varying shapes and sizes to expose external electrodes of semiconductor ICs, eliminating the need for pad layers and allowing for optimized via conductor sizing based on electrode type, thereby reducing resistance and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If stud bumps and transition layers are formed on pad electrodes to connect semiconductor ICs, then electrical connection is achieved, but production costs increase and board thickness increases
Solution Approach 1:
The invention extracts and eliminates the unnecessary intermediate structures (stud bumps and transition layers) from the connection path. By directly exposing the external electrodes of the semiconductor IC through via holes in the resin substrate, the connection is simplified to only the essential via conductors, removing redundant components that increase cost and complexity.
Solution Approach 2:
Instead of forming pad electrodes on the semiconductor IC and then connecting them through complex structures, the invention inverts the approach by directly exposing the external electrodes through via holes in the substrate. This reverses the conventional sequence and eliminates the need for intermediate connection structures.
2Reliability
If stud bumps and transition layers are formed on pad electrodes, then electrical connection is achieved, but board thickness increases
Solution Approach 1:
The invention extracts and removes the thickness-contributing elements (stud bumps and transition layers) from the vertical stack. By directly exposing external electrodes through via holes, the connection path is shortened, enabling thinner board designs while maintaining reliable electrical connection.
3Ease of manufacture
If all via conductors have the same diameter and shape, then manufacturing is simplified, but resistance cannot be optimized for specific power supply lines
Solution Approach 1:
The invention applies local quality by allowing via conductors to have different diameters and shapes depending on their specific function. Power supply via conductors can be made with larger cross-sections to reduce resistance, while signal via conductors can be smaller. This localized optimization balances manufacturing feasibility with performance requirements.
Solution Approach 2:
The invention changes the parameters (diameter and shape) of via conductors based on their functional requirements. By adjusting these parameters locally for different via conductors, the resistance of power supply lines can be optimized without compromising the overall manufacturability of the board.
4Reliability
If pad layers are formed on semiconductor ICs, then external electrodes are properly configured, but production costs increase and thickness increases
Solution Approach 1:
The invention extracts and eliminates the pad layer from the semiconductor IC structure. By directly exposing the external electrodes without requiring pad layers, the design simplifies the electrode configuration process and reduces production costs while maintaining proper electrical connection functionality.
Data Source
AI summary
Disclosed herein is a circuit board that includes a resin substrate including a substrate wiring layer, and an electronic component embedded in the resin substrate and having a plurality of external electrodes. The resin substrate includes a plurality of via holes that expose the external electrodes and a plurality of via conductors embedded in the via holes to electrically connect the substrate wiring layer to the external electrodes. At least some of the via holes are different in planar shape from each other.