LED Circuit Board Parallel Testing Segmentation
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Solution Overview
Problem
The miniaturization of LED pixel packages complicates testing and packaging, making it time-consuming and costly due to the small size and large number of units, with defects often resulting in entire packages being discarded.
Innovation Solution
An LED circuit board structure with multiple LEDs connected in parallel via testing and connecting wires on a carrier board, allowing for efficient testing and packaging by separating individual pixels after testing, reducing waste and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LED pixel packages are tested one by one after sealing, then testing can be performed, but the process becomes time-consuming and costly due to small size and large number of units
Solution Approach 1:
The carrier board is divided into multiple pixel-front-side-pattern regions, each containing multiple LED pixel packages that can be tested independently. This segmentation allows parallel testing of multiple packages simultaneously, improving testing efficiency while maintaining complete coverage of all units.
Solution Approach 2:
The testing wires are pre-connected to the LED pixel packages before sealing, enabling testing to be performed on the carrier board level prior to individual packaging. This preliminary testing action allows defective packages to be identified and separated before final sealing, improving both efficiency and reliability.
2Reliability
If LED pixel packages are tested one by one after sealing, then individual testing is possible, but the entire package must be discarded if a defect is found, resulting in waste of cost
Solution Approach 1:
The carrier board structure allows individual pixel packages to be independently tested and separated. When a defect is detected in one package, only that specific package needs to be separated and discarded, while other packages on the same carrier board remain functional and can be packaged separately, significantly reducing material waste.
Solution Approach 2:
The testing and separating function is extracted from the final packaged unit and performed at the carrier board level before packaging. This extraction allows defective individual packages to be identified and removed from the carrier board without affecting other packages, enabling selective discarding rather than total package rejection.
3Ease of manufacture
If multiple pixels are combined into one LED pixel package, then mounting cost is reduced, but testing becomes more difficult and time-consuming
Solution Approach 1:
The carrier board is segmented into multiple pixel-front-side-pattern regions, each containing multiple LED pixel packages that can be tested independently through separate testing wires. This segmentation enables parallel testing of multiple packages simultaneously, maintaining the cost advantage of combined mounting while improving testing speed through concurrent processing.
Solution Approach 2:
Testing wires are pre-connected to multiple pixel packages on the carrier board before final packaging occurs. This preliminary wiring arrangement enables batch testing of multiple packages in parallel at the carrier board level, significantly improving testing speed while maintaining the manufacturing efficiency benefits of combined pixel mounting.
Data Source
AI summary
An LED circuit board structure includes first color LEDs, second color LEDs, third color LEDs, a carrier board, first testing wires, first connecting wires, second testing wires and second connecting wires. Each of the first testing wire is located at the carrier board and electrically connects two first color LEDs in a pixel-front-side-pattern region in parallel. The first connecting wire electrically connects two first testing wires in adjacent two pixel-front-side-pattern regions. Each of the second testing wire is located at the carrier board and electrically connects two second color LEDs in a pixel-front-side-pattern region in parallel. The second connecting wire electrically connects two second testing wires in adjacent two pixel-front-side-pattern regions.