Inductor Pin Integration for DC-DC Converter Volume Reduction

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Solution Overview

Problem

Conventional point of load (POL) DC to DC converters suffer from low power density and increased volume due to the use of through-hole and wave pins, which occupy space and height on circuit boards, making them inefficient in terms of size and power density.

Innovation Solution

The implementation of a novel pin scheme where an inductive component is wrapped with a conductive layer, featuring connecting and pin conductors that provide electrical connections without direct physical contact, allowing for reduced space occupation and enhanced heat dissipation, thereby improving power density and shrinking overall dimensions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If through-hole pins are used for connecting the converter to the circuit board, then reliable electrical connection is achieved, but the occupied area and height increase, reducing power density

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidconverter volume

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent extracts the pin structure from the traditional through-hole configuration and repositions it to the bottom surface of the inductor component. This allows the pins to be integrated into the inductor's mounting footprint rather than occupying separate areas on the circuit board, thereby reducing the overall converter volume while maintaining reliable electrical connections.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent transitions from a planar pin arrangement (occupying board surface area) to a three-dimensional configuration where pins extend from the bottom surface of the inductor. This dimensional change allows electrical connections to be made without increasing the converter's planar footprint, effectively reducing the occupied volume.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If wave pins are used for connecting the converter to the circuit board, then electrical connection is established, but the pin height increases the overall converter volume, lowering power density

Engineering Contradiction:

Improveelectrical connectionVSAvoidpin height

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent merges the pin structure with the inductor component by integrating the pins into the bottom surface of the inductor. This combination eliminates the need for separate wave pin structures that extend upward from the circuit board, thereby reducing the overall converter height while maintaining electrical connectivity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Instead of having pins extend upward from the circuit board (traditional wave pin configuration), the patent inverts the approach by having pins extend downward from the inductor's bottom surface. This inversion reduces the vertical space required for electrical connections, thereby reducing converter volume and improving power density.

Inventive Principle:

Principle #13The other way round (Inversion)

3Reliability

If conventional pin arrangements are used, then electrical connections are made, but space occupation on the circuit board increases, reducing power density

Engineering Contradiction:

Improveelectrical connectionVSAvoidboard space occupation

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The inductor component is given multiple functions: it serves as both the magnetic component and the mounting structure for electrical connections. The bottom surface of the inductor acts as both a mechanical support and an electrical interface, eliminating the need for separate pin structures that would occupy additional board space.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The pin structures are nested within the inductor's mounting footprint. The pins are positioned such that their electrical connection points fall within the area already occupied by the inductor's footprint on the circuit board, effectively nesting the connection function within the existing component space rather than adding to it.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS9030027B2Assembled circuit and electronic component

Publication Date: 2015.05.12 DELTA ELECTRONICS INC(CN)

AI summary

An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends from the top surface to the bottom surface via one of the side surfaces of the inductor, wherein a circuit board is disposed over the top surface of the first electronic component and electrically connected to the plurality of conductors and a plurality of pins disposed on the bottom surface of the inductor for connecting to another circuit board.