Flexible Circuit Assembly for Capacitive Touch Devices
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Solution Overview
Problem
Capacitive-sensing devices face challenges in maximizing the active touch-space due to space consumption by interconnection assemblies at their borders, which limits user interaction experience.
Innovation Solution
A flexible circuit assembly that folds between conductive contact pads on a capacitive-sensing device substrate, allowing for a smaller border and increased touch area by directly connecting to electrodes, reducing the need for peripheral traces and enabling narrower trace widths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If interconnection assemblies are attached at borders of capacitive-sensing device, then electrical connections are established, but visible touch-space is reduced
Solution Approach 1:
The flexible circuit transitions from a planar layout to a three-dimensional folded configuration, allowing electrical connections to be made at non-adjacent edges of the substrate. This dimensional change enables the circuit to bypass the border area, preserving visible touch-space while maintaining connectivity.
Solution Approach 2:
The patent employs a flexible circuit that can be folded and conform to the substrate geometry. This flexibility allows the interconnection assembly to be routed through the folded structure rather than occupying border space, thereby increasing the visible touch area while maintaining electrical connections.
2Area of stationary object
If flexible circuit is folded to connect non-parallel edges, then border space is reduced, but manufacturing complexity increases
Solution Approach 1:
The flexible circuit is divided into multiple portions (first, second, and third portions) that can be independently routed and folded. This segmentation allows each portion to be optimized for its specific function and simplifies the manufacturing process by enabling modular assembly and alignment.
Data Source
AI summary
A flexible circuit assembly is provided which includes a flexible circuit, a substrate of a capacitive-sensing device and an electronic component that are coupled to the flexible circuit. The flexible circuit includes a first portion having a first conductive contact pad, a second portion having a second conductive contact pad, and a third portion disposed between the first portion and the second portion. The flexible circuit is configured to fold at the third portion between the first portion and the second portion so that the first conductive contact pad couples to a first conductor disposed along a first edge of the substrate and the second conductive contact pad couples to a second conductor disposed along a second edge of the substrate of the capacitive-sensing device. The first edge of the substrate of the capacitive-sensing device is non-parallel to the second edge of the substrate of the capacitive-sensing device.