Circuit Board Layer Build-Up Positioning Precision
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Solution Overview
Problem
Conventional circuit board layer build-up processes suffer from layer errors due to misalignment of positioning holes across different layers, leading to reduced precision and yield, as existing techniques fail to ensure accurate positional alignment of these holes.
Innovation Solution
A circuit board layer build-up process that includes forming self-adhesive copper foil with target windows and insulating adhesive windows, each with a larger contour than the corresponding positioning holes, allowing for precise machine vision-based positioning and preventing layer errors by using these features as reference points for subsequent layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional positioning holes are used for machine vision-based positioning, then the positioning process can be completed, but layer errors occur due to misalignment of positioning holes across different layers
Solution Approach 1:
The patent segments the positioning reference into two distinct parts: the small positioning target through hole (for precise location) and the large copper foil target window/insulating adhesive target window (for easy machine vision detection). This segmentation allows each part to fulfill its specific function optimally, resolving the contradiction between detection ease and positioning precision.
Solution Approach 2:
The patent extends the positioning reference from a single-point through hole to a two-dimensional structure (copper foil target window and insulating adhesive target window) that surrounds the through hole. This dimensional expansion provides both precise positioning (via the through hole) and easy detection (via the larger window area), resolving the alignment accuracy issue.
2Adaptability or versatility
If multiple layer build-up processes are performed, then complex multi-layer circuit boards can be manufactured, but accumulated layer errors reduce precision and yield
Solution Approach 1:
The patent performs preliminary action by forming the copper foil target window and insulating adhesive target window before the layer build-up process. These target windows serve as stable, pre-established reference marks that remain unchanged through subsequent processing steps, enabling consistent positioning across multiple layer build-up cycles and preventing accumulated errors.
Solution Approach 2:
The patent creates a copy of the positioning reference function by forming copper foil target windows and insulating adhesive target windows that replicate the positioning capability of the original through holes. These target windows serve as additional reference points that can be used for machine vision-based positioning, ensuring consistency across multiple layers without accumulating errors.
3Ease of manufacture
If standard positioning holes are used, then the process is simple, but the mechanical tolerances of drilling equipment and X-ray positioning equipment cause misalignment
Solution Approach 1:
The patent introduces copper foil target windows and insulating adhesive target windows as intermediary elements between the positioning system and the layer build-up process. These intermediaries amplify the positioning signal by providing larger, easier-to-detect targets while the small through holes maintain the original positioning precision, thus improving reliability without complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process enhances positioning precision and yield by ensuring accurate alignment of newly added layers, preventing layer errors and maintaining high precision across multiple build-up cycles.
Implementation Method 1
adhesively attaching a self-adhesive copper foil to the semi-finished circuit board by vacuum pressing
Data Source
AI summary
A circuit board layer build-up process with enhanced positioning precision is provided. The circuit board layer build-up process is advantageous in that regardless of the number of times for which the circuit board layer build-up process has been performed in a row, all the newly added layers are formed with target windows (including copper foil target windows and insulating adhesive target windows) each having a larger contour than the corresponding positioning target through hole. During the via forming process and the subsequent patterning process, therefore, machine vision-based positioning can always be carried out using the positioning target through holes in the substrate layer as positioning reference points, thereby preventing layer errors and increasing the precision and yield of circuit boards.