Anisotropic Conductive Fabric for Semiconductor Package Interconnections

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Solution Overview

Problem

Current semiconductor package technologies face challenges in achieving high reliability and durability while maintaining miniaturization, high performance, and cost-effectiveness, particularly in ensuring stable electrical connections and flexibility under thermal and physical stresses.

Innovation Solution

A semiconductor package incorporating an anisotropic conductive fabric woven with conductive fibers as wefts and insulative fibers as warps, attached to connection pads on a flexible substrate, providing electrical connections through bumps that are not directly aligned with the pads, and using solder for conductive connection members to secure the fabric and prevent short-circuiting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional rigid interconnection methods are used, then electrical connection stability is improved, but flexibility and resistance to warpage are worsened

Engineering Contradiction:

Improveelectrical connection stabilityVSAvoidflexibility under thermal and physical stresses

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent employs an anisotropic conductive fabric composed of conductive fibers woven into a flexible substrate structure. This composite material provides both electrical conductivity through the conductive fibers and flexibility through the woven fabric architecture, resolving the contradiction between connection stability and adaptability to thermal/physical stresses.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The conductive fabric is implemented as a flexible interconnection layer that can bend and deform without breaking electrical connections. The fabric's flexible nature allows it to accommodate warpage and external forces while maintaining reliable electrical connectivity, directly addressing the contradiction between rigidity for stability and flexibility for stress resistance.

Inventive Principle:

Principle #30Flexible shells and thin films

2Manufacturing precision

If direct alignment between bumps and connection pads is required, then manufacturing precision is improved, but alignment margins and tolerance to misalignment are worsened

Engineering Contradiction:

Improvealignment accuracyVSAvoidinterconnection failure resistance

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The conductive fabric divides the interconnection function into multiple conductive fiber paths distributed across the fabric surface. This segmentation allows electrical connections to be established through multiple possible pathways, increasing alignment margins and tolerance to misalignment between bumps and connection pads while maintaining manufacturing precision.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from point-to-point rigid alignment to a distributed two-dimensional conductive network. The conductive fibers are arranged in a woven pattern that provides multiple connection paths across the fabric surface, allowing bumps to connect to connection pads through various routes and increasing tolerance to alignment variations.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Volume of moving object

If miniaturization is pursued, then device size is reduced, but reliability and durability under stress are worsened

Engineering Contradiction:

Improvepackage sizeVSAvoiddurability under thermal and physical stresses

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The flexible conductive fabric serves as a thin-film interconnection layer that maintains durability under thermal and physical stresses while enabling miniaturization. The fabric's flexibility allows it to withstand stress in compact packages where rigid interconnections would fail, resolving the contradiction between size reduction and reliability maintenance.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the reliability and durability of semiconductor packages by providing flexible and stiff interconnections that withstand warpage and external forces, increasing alignment margins and preventing interconnection failures, thus improving the overall performance and reliability of semiconductor devices.

Implementation Method 1

an anisotropic conductive fabric woven by using conductive fibers as wefts and using insulative fibers as warps

Methodology Applied

Scientific EffectAnisotropic conduction: Anisotropy

Implementation Method 2

each bump is electrically connected to at least one conductive fiber at a position turned aside from each connection pad

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9786590B2Semiconductor package including a conductive fabric

Publication Date: 2017.10.10 MIMIRIP LLC

AI summary

A semiconductor package may be provided. The semiconductor package may include a substrate formed with one or more connection pads. The semiconductor package may include a semiconductor device including at least one bump. The semiconductor package may include an anisotropic conductive fabric including conductive fibers and configured to electrically couple the at least one connection pad to the at least one bump.