Flexible Substrate Alignment via Disposable Polymer Tape
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Solution Overview
Problem
The existing processes for manufacturing electronic components on flexible substrates face challenges such as alignment deviation due to substrate deformation from temperature and stress, complex binder selection, and high costs associated with vacuum equipment, especially when using thermoplastic or UV-sensitive materials, which complicate the separation process and affect the flatness and uniformity of the substrate.
Innovation Solution
An alignment precision enhancement method involving the use of a polymer tape to fix the flexible substrate on a substrate holder, deposition of an indium tin oxide layer, creation of alignment marks, and separation using an unstressed cutting machine, allowing for precise alignment and compatibility with roll-to-roll processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a glass substrate is used as a holder for adhering the plastic substrate, then the substrate can be fixed during processing, but the process becomes complicated and material selection is restricted due to the need for special binders that can bear high temperatures
Solution Approach 1:
The patent replaces the glass substrate holder with a disposable release film that is discarded after use. This eliminates the need for complex binder materials and high-temperature processing, allowing the use of low-cost plastic substrates without requiring special temperature-resistant binders.
Solution Approach 2:
The patent changes the processing temperature parameter from high temperature (200°C) to low temperature processing. This parameter change allows the use of plastic substrates without requiring temperature-resistant binders, simplifying the material selection and process complexity.
2Reliability
If vacuum equipment is used for deaerating the sealant, then the seal quality is improved, but the equipment cost and process complexity increase significantly
Solution Approach 1:
The patent uses a disposable release film instead of expensive vacuum equipment for deaerating the sealant. The release film is designed to be discarded after single use, eliminating the need for costly vacuum press machines and exposure machines while achieving adequate seal quality.
Solution Approach 2:
The patent extracts the deaerating function from the expensive vacuum equipment and transfers it to the release film system. The release film is applied in a way that naturally excludes air during the lamination process, removing the need for vacuum equipment entirely.
3Ease of operation
If alignment marks are not pre-established on the substrate holder, then the substrate can be placed freely, but alignment precision deteriorates due to substrate deformation from temperature and stress
Solution Approach 1:
The patent applies the release film and establishes alignment marks on the substrate holder before placing the substrate. This preliminary action ensures that alignment marks are already in position to guide accurate substrate placement, compensating for any subsequent substrate deformation during processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves alignment precision, simplifies the process, reduces costs by eliminating the need for expensive vacuum equipment, and ensures uniformity and stability of the flexible substrate during electronic component manufacturing.
Implementation Method 1
completely sticking the flexible substrate by a polymer tape using a press machine, thereby the flexible substrate is adhesively fixed on the substrate holder through the polymer tape
Implementation Method 2
depositing an indium tin oxide layer on the polymer tape and on the alignment mark areas
Implementation Method 3
separating the flexible substrate from the substrate holder using an unstressed cutting machine
Data Source
AI summary
Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same is proposed. The process step of a flexible substrate is put on a substrate holder, wherein the flexible substrate is fixed by a polymer tape. A plural of alignment marks is making for lithography process. An unstressed cut is separated the flexible substrate and substrate holder when the electronic component is made.