Flexible Orthogonal Connectors for Low Insertion Force Datacenter Interconnects
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Solution Overview
Problem
Existing datacenter technologies face challenges in efficiently connecting circuit boards due to issues like signal distortion, device damage from high insertion forces, and the need for costly and space-consuming fiber optic cables.
Innovation Solution
The implementation of a system that uses flexible orthogonal connectors to connect circuit boards at any angle between 0 and 180 degrees, reducing the need for cables and enabling liquid cooling, while also using a reduced thickness motherboard design to increase device density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fiber optic cables are used to provide communicative coupling between clusters of devices, then signal transmission quality is improved, but cost and space consumption increase
Solution Approach 1:
The patent extracts the communication function from external fiber optic cables and integrates it directly into the circuit board through embedded optical channels and waveguides. This eliminates the need for separate cable infrastructure while maintaining high-speed signal transmission capability.
Solution Approach 2:
The patent merges the communication transmission medium with the circuit board substrate itself by embedding optical channels and waveguides within the board structure. This consolidation eliminates separate cable systems and reduces overall space requirements while preserving signal quality.
2Speed
If EXA connector is used for circuit board-to-circuit board connection at gigabit per second transfer rates, then data transmission speed is improved, but insertion force requirement increases causing potential device damage
Solution Approach 1:
The patent employs preliminary alignment features such as guide pins, alignment marks, and mechanical guides that pre-position connectors before final engagement. This preliminary action ensures precise positioning, allowing the connectors to engage smoothly at low force while maintaining the high-speed data transmission capability of EXA connector technology.
Solution Approach 2:
The patent introduces intermediary alignment and guidance mechanisms between the connector components. These intermediaries (guide pins, alignment features) mediate the connection process, enabling high-speed signal transmission without requiring excessive insertion force that could damage the circuit board or connected devices.
3Reliability
If EXA connector is used for circuit board connection, then data transmission capability is improved, but connector size increases blocking airflow to devices
Solution Approach 1:
The patent transitions connector elements from a planar two-dimensional layout to a three-dimensional configuration. By stacking connector components vertically and utilizing the Z-dimension, the design achieves high-speed data transmission capability without increasing the horizontal footprint, thereby preserving airflow channels and reducing the area blocked on the circuit board.
Solution Approach 2:
The patent nests connector components within each other or within the circuit board substrate itself. By embedding optical channels and waveguides within the board structure and nesting connector elements, the design achieves full data transmission capability while minimizing the external footprint and preserving space for airflow and cooling.
4Stability of the object's composition
If high insertion force is applied during connector connection, then connection stability is improved, but circuit board warping occurs causing signal distortion
Solution Approach 1:
The patent uses preliminary alignment features and gradual engagement mechanisms that prepare the connection interface before final contact. This staged approach allows the connector to engage progressively, distributing forces evenly and achieving stable connection without applying excessive force that would warp the circuit board or distort signals.
Solution Approach 2:
The patent incorporates compliance features and flexible elements that act as counterbalancing mechanisms during connector engagement. These elements absorb and distribute insertion forces, preventing localized stress concentrations that could cause circuit board warping while still achieving stable electrical and optical connections.
Data Source
AI summary
Examples described herein relate to an apparatus that includes a flexible conductor covered in an insulative material and at least one conductor region in contact with the flexible conductor. In some examples, melting of the at least one conductor region is to cause a conductive coupling of the flexible conductor with a second conductor and wherein the flexible conductor is adapted to conductively couple a first circuit board oriented orthogonal to a second circuit board. In some examples, the at least one conductor region comprises at least one solder ball of a grid array. In some examples, the at least one conductor region is re-solderable.