Rigid-Flex PCB Size Matching via C-Shaped Cutouts

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Solution Overview

Problem

The production of rigid-flex printed circuit boards (RFPCBs) often results in wastage of materials due to mismatched standard lengths and widths of flexible and rigid printed circuit boards, leading to increased costs.

Innovation Solution

A method involving the creation of C-shaped cutouts and protrusions on flexible printed circuit boards (FPCBs) to enable precise alignment and combination with rigid printed circuit boards (RPCBs), followed by reinforcement layers and via formation to achieve size matching and reduced material waste.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If standard length and width FPCBs and RPCBs are used, then manufacturing is simplified, but material wastage increases due to size mismatch

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidmaterial wastage
Core Design Contradiction:
Ease of manufactureVSLoss of substance

Solution Approach 1:

The FPCB is divided into a rigid portion and a flexible portion with different standard sizes. The rigid portion uses a standard-sized raw board for easy manufacturing, while the flexible portion can be custom-cut to match the RPCB size, thereby reducing material wastage while maintaining manufacturing simplicity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the FPCB are designed with different characteristics: the rigid portion has standard dimensions for ease of manufacturing, while the flexible portion has customized dimensions to match the RPCB size, minimizing material wastage locally where needed.

Inventive Principle:
Principle #3Local quality

2Loss of substance

If FPCBs are custom-cut to match RPCB sizes, then material wastage is reduced, but manufacturing complexity increases

Engineering Contradiction:
Improvematerial wastageVSAvoidmanufacturing complexity
Core Design Contradiction:
Loss of substanceVSDevice complexity

Solution Approach 1:

By segmenting the FPCB into rigid and flexible portions with different size requirements, the patent allows the rigid portion to be manufactured using standard processes while the flexible portion can be custom-cut, reducing overall manufacturing complexity compared to custom-cutting the entire FPCB.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The rigid portion is pre-manufactured with standard dimensions before the flexible portion is custom-cut to match the RPCB size. This preliminary action simplifies the overall manufacturing process by establishing a standardized base structure before performing custom modifications.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If C-shaped cutouts and protrusions are added to FPCBs, then alignment precision is improved, but structural complexity increases

Engineering Contradiction:
Improvealignment precisionVSAvoidstructural complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

C-shaped cutouts and protrusions are added to specific asymmetric locations on the FPCB to achieve precise alignment with the RPCB. These asymmetric features are strategically placed only where needed for alignment, minimizing the increase in structural complexity while improving alignment precision.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The C-shaped cutouts and protrusions act as intermediary alignment features between the FPCB and RPCB. These intermediate structural elements facilitate precise positioning and alignment during assembly, reducing the need for more complex alignment mechanisms.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS9072173B2Rigid-flex printed circuit board and method for making same
Publication Date: 2015.06.30 GARUDA TECH CO LTD
  • US9072173B2 patent drawing
  • US9072173B2 patent drawing
  • US9072173B2 patent drawing

AI summary

An RFPCB includes a reinforcement layer and at least two FPCBs spliced together to match the reinforcement layer in shape and size. The FPCBs are adhered onto the reinforcement layer. The reinforcement layer includes circuits connected with the FPCB and has portions removed to obtain a desired flexibility.