Conductive Adhesive Attachment Apparatus for FPC and COF
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Solution Overview
Problem
In the manufacturing of flexible printed circuit boards and chip on film, the conductive adhesive is often cured prematurely due to heat from high-temperature squeeze connectors, leading to poor connections and increased manufacturing costs due to product replacement and discarding.
Innovation Solution
An attachment apparatus and method that selectively applies conductive adhesive to specific regions of a printed circuit board, using a carrier stage with vacuum adsorption and drive mechanisms to prevent premature curing, allowing for precise attachment and recycling of the adhesive, thereby improving connection quality and reducing waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive adhesive is attached to both electrode regions of FPC board or COF, then complete electrical connection is achieved, but premature curing occurs due to heat from high temperature squeeze connector
Solution Approach 1:
The conductive adhesive is segmented into two independent portions: one attached to the FPC board electrode region and another to the COF electrode region. This segmentation allows each portion to be applied separately, preventing the heat from the first squeeze connection from curing the second portion prematurely, while still achieving complete electrical connection when both are assembled.
Solution Approach 2:
The conductive adhesive is pre-applied to the FPC board and COF in separate portions before the actual assembly. This preliminary action allows the adhesive to be in position and ready for assembly, but not yet cured, avoiding the premature curing problem while ensuring proper alignment and connection.
2Reliability
If conductive adhesive is applied to both electrode regions, then complete connection is achieved, but manufacturing cost increases due to product replacement and recycling
Solution Approach 1:
By segmenting the conductive adhesive into separate portions applied to different components, the invention enables selective replacement of only the defective portion rather than discarding the entire FPC board or COF. This reduces material waste and manufacturing costs while maintaining complete connection functionality.
Solution Approach 2:
The invention facilitates the recovery and reuse of FPC boards and COF by allowing the conductive adhesive to be applied in a controlled manner that prevents premature curing. This enables defective assemblies to be separated and reused, reducing material loss and associated costs.
3Ease of manufacture
If conductive adhesive is attached to one electrode region first, then assembly can proceed, but heat from squeeze connector cures the adhesive in the other electrode region in advance
Solution Approach 1:
The conductive adhesive is divided into separate portions for different electrode regions, allowing the assembly process to proceed systematically without causing premature curing of subsequent adhesive applications. Each portion can be applied and positioned independently with precise control over the timing and conditions of its curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents premature curing of the conductive adhesive, enhances the recycling rates of flexible printed circuit boards and chip on film, and decreases manufacturing costs by allowing for the reattachment and reuse of components.
Implementation Method 1
a vacuum adsorption device being connected to each of the plurality of adsorption holes
Data Source
AI summary
Embodiments of the present invention provide an attachment apparatus and an attachment method for a conductive adhesive. The attachment apparatus includes: a carrier stage, which is provided with at least one working surface, the working surface being configured to support a printed circuit board and provided with a groove, and the groove being provided with a plurality of adsorption holes on its bottom surface; a vacuum adsorption device being connected to each of the plurality of adsorption holes; and an attaching mechanism provided above the carrier stage, and configured to attach the conductive adhesive to a predetermined region of the printed circuit board, and the predetermined region being a region of the printed circuit board to be squeeze connected to a flexible printed circuit board or a chip on film.