Stepped Lid Circuit Module Voids Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-frequency circuit modules with dielectric material substrates face issues with solder or adhesive joining, leading to voids and scattered particles that affect the operation and characteristics of electronic parts, causing reliability concerns such as short circuits and corrosion.
Innovation Solution
A circuit module design featuring a stepped lid with protrusions and dents, where the protrusions are in contact with the ceramic substrate and the dents are joined with solder, preventing voids and flux from entering the cavity, ensuring reliable joining without exposing solder to the interior.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solder paste is used to join the ceramic substrate to the lid, then joining is achieved, but voids due to remaining flux burst upon heating, scattering solder balls and flux within the cavity
Solution Approach 1:
The lid is divided into a first lid portion and a second lid portion, creating a segmented structure where the first lid portion covers the cavity opening and the second lid portion is positioned away from it. This segmentation allows the joining process to occur outside the cavity region, preventing flux and solder balls from entering the cavity while maintaining the joining function.
2Ease of manufacture
If electroconductive resin is used to join the ceramic substrate to the lid, then joining is achieved, but voids formed in the resin burst upon joining, scattering particles within the cavity
Solution Approach 1:
The lid is divided into a first lid portion and a second lid portion, creating a segmented structure where the first lid portion covers the cavity opening and the second lid portion is positioned away from it. This segmentation allows the joining process to occur outside the cavity region, preventing resin particles from entering the cavity while maintaining the joining function.
3Ease of manufacture
If a flat container main body made of dielectric material is used, then production process is simplified and cost is reduced, but it cannot be joined to the lid by welding, requiring solder or adhesive joining
Solution Approach 1:
The lid is divided into a first lid portion and a second lid portion, allowing the joining process to be separated from the cavity region. This enables the use of solder or adhesive joining methods for the dielectric material substrate without causing contamination to the cavity, thus maintaining the advantages of dielectric materials while managing the complexity of the joining process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents the scattering of solder and flux within the cavity, enhancing the reliability of the circuit module by avoiding short circuits and corrosion, while maintaining high operational performance.
Implementation Method 1
the dents being joined to the ceramic substrate pads with solder
Data Source
AI summary
A process for producing a circuit module including, carried out in this order, preparing a ceramic carrier substrate having ceramic substrate pads for mounting electronic parts, forming solder paste layers on the ceramic substrate pads, forming precoated solder layers by heating the ceramic carrier substrate having the solder paste layers on the ceramic substrate pads to melt the solder paste layers, and then cooling for solidifying the solder, preliminarily fixing stepped lid having protrusions adjacent to a cavity and dents adjacent to the cavity with the protrusions intervening therebetween to the precoated solder layers of the ceramic carrier substrate and joining the stepped lid to the ceramic carrier substrate with solder by placing the ceramic carrier substrate having the stepped lid preliminarily fixed to the precoated solder layers in a reflow furnace.