Multi-layer Wiring Board with Elastic Shock Absorption
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Solution Overview
Problem
Existing wiring boards face challenges in balancing rigidity and flexibility, particularly in accommodating diverse electronic components and withstanding mechanical impacts, as they often lack sufficient shock absorption and flexibility to prevent component rupture upon impact.
Innovation Solution
A wiring board design featuring a multi-layer section with a thicker, more rigid base substrate and a thinner, flexible section with a smaller mounting area, where the first substrate extends beyond the second substrate, incorporating interstitial via holes and interlayer grooves filled with elastic materials for enhanced shock absorption and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wiring board uses a uniform thickness structure, then the manufacturing process is simple, but the board lacks sufficient shock absorption and flexibility to prevent component rupture upon impact
Solution Approach 1:
The wiring board is divided into multiple sections with different thicknesses: a first section with greater thickness and a second section with smaller thickness. This segmentation allows different regions to serve different functions - the thicker section provides shock absorption and flexibility, while the thinner section maintains rigidity for component mounting, thereby resolving the contradiction between impact tolerance and structural simplicity.
Solution Approach 2:
Different sections of the wiring board are given different local qualities in terms of thickness and material composition. The first section has greater thickness and contains elastic material for shock absorption, while the second section has smaller thickness for rigidity. This local differentiation enables the board to simultaneously achieve flexibility where needed and structural integrity where required.
2Strength
If the wiring board uses a thicker, more rigid structure, then the board can withstand mechanical impacts, but it lacks flexibility and shock absorption capability
Solution Approach 1:
The board is segmented into a first section with greater thickness for strength and a second section with smaller thickness for flexibility. This segmentation allows the thicker portion to provide mechanical strength while the thinner portion provides shock absorption, resolving the contradiction between these two requirements.
Solution Approach 2:
The wiring board incorporates elastic material within its structure, creating a composite construction that combines rigid substrate material with flexible elastic material. This composite approach enables the board to simultaneously achieve mechanical strength from the rigid portions and shock absorption from the elastic material, resolving the contradiction between strength and flexibility.
3Adaptability or versatility
If the wiring board has a uniform mounting area, then the design is simple, but it cannot accommodate diverse electronic components with different size requirements
Solution Approach 1:
The mounting area is segmented into a first mounting area in the first section and a second mounting area in the second section, with different sizes and configurations. This segmentation allows each section to be optimized for specific component types - the larger first section can accommodate bigger components while the smaller second section suits compact components, thereby achieving versatile component accommodation without excessive design complexity.
Solution Approach 2:
Different mounting areas are provided with different local qualities in terms of size and structural characteristics. The first mounting area has larger dimensions for accommodating bigger components, while the second mounting area has smaller dimensions for compact components. This local differentiation enables the board to accommodate diverse electronic components while maintaining a relatively simple overall design structure.
4Reliability
If the wiring board uses a multi-layer structure with different thicknesses, then it achieves better shock absorption, but the manufacturing process becomes more complex
Solution Approach 1:
The manufacturing process is segmented into distinct stages: forming the first insulating layer and first conductor layer, then forming the second insulating layer and second conductor layer with different thicknesses. This segmentation of the manufacturing process allows each layer to be optimized independently while maintaining overall manufacturing feasibility, resolving the contradiction between achieving complex multi-layer structures and maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the board's impact tolerance, prevents component rupture, and allows for compact packaging and easy separation, while maintaining reliable electrical connections and component mounting capabilities.
Implementation Method 1
interlayer grooves filled with elastic materials for enhanced shock absorption and flexibility
Data Source
AI summary
A wiring board and a method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) penetrates the base substrate.