Compression-Molded Circuit Board for Ultra-Thin Camera Modules
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Solution Overview
Problem
Conventional camera modules face an irreconcilable contradiction between achieving high performance and ultra-thinness due to the increasing size of electrical and electronic components, which complicates assembly and affects image quality and device thickness.
Innovation Solution
A camera module with a compression-molded circuit board manufactured using a molding method, integrating electrical components and optical elements, featuring a thin, highly integrated, and fine-line-width circuit board structure, optimized through the use of hot melting or hot setting materials like epoxy resin, and reinforced with laminated layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional COB technology is used with all electrical and electronic parts arranged on the surface of the circuit board, then the assembly process is straightforward, but the overall size of the camera module becomes bigger and the thickness increases
Solution Approach 1:
The patent transitions from surface-mounted component arrangement to three-dimensional stacked arrangement. Multiple circuit boards are stacked vertically with components distributed across different layers, enabling spatial optimization and reducing the overall projection area and thickness of the camera module while maintaining assembly feasibility through standardized stacking processes
2Reliability
If the number of electrical and electronic components on the circuit board is increased to meet high-pixel and high image quality demands, then the imaging performance is improved, but the size of the camera module becomes bigger
Solution Approach 1:
The patent implements a stacked multi-layer architecture where additional circuit boards and components are arranged vertically rather than horizontally. This three-dimensional configuration allows more components to be integrated without increasing the projection area, thus maintaining compact size while achieving high-pixel and high image quality requirements
Solution Approach 2:
The patent employs a nested stacking structure where multiple circuit boards are vertically integrated with each other. Components on upper layers are positioned above components on lower layers, creating a compact nested arrangement that maximizes component density within a small volume, thereby improving imaging performance without increasing overall module size
3Adaptability or versatility
If the circuit board size is increased to accommodate more components, then the component configuration flexibility is improved, but the thickness of the camera module increases
Solution Approach 1:
The patent redistributes components across multiple vertical layers instead of spreading them out horizontally. By stacking circuit boards vertically with controlled thickness for each layer, the design achieves high component configuration flexibility while maintaining ultra-thin overall profile, as the thickness contribution of each layer is minimized through compact stacking
4Ease of manufacture
If conventional manufacturing methods are used, then the production process is simple, but the circuit board size and camera module size become bigger
Solution Approach 1:
The patent adopts a stacked manufacturing approach where multiple circuit boards are manufactured separately using conventional processes and then assembled vertically. This maintains the simplicity of conventional manufacturing for each individual board while achieving compact overall dimensions through the stacked configuration, avoiding the need for complex custom manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, high-performance camera module with improved image quality and reduced thickness, addressing the challenge of balancing component configuration and board size while maintaining high pixel and image quality standards.
Implementation Method 1
the circuit board is manufactured using a molding method, integrating electrical components and optical elements
Implementation Method 2
optimized through the use of hot melting or hot setting materials like epoxy resin
Implementation Method 3
optimized through the use of hot melting or hot setting materials like epoxy resin
Data Source
AI summary
A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.