Flexible Display Driving Chip Attachment via Hot-Melt Protection
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Solution Overview
Problem
Conventional flexible displays face reliability issues due to the rigidity of driving chip pins and trace layers, which can break or develop defects when separating from rigid substrates during the manufacturing process.
Innovation Solution
The flexible display apparatus employs a chip on film (COF) technique with anisotropic conductive films and hot-melt protective layers to securely attach driving chips to flexible circuit boards, preventing pin breakage and enhancing structural reliability by distributing stress and reinforcing the structure between the flexible display panel and circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a driving chip is attached to a flexible display panel using conventional methods, then the display panel can be manufactured, but the rigid pins of the driving chip are likely to break or the trace layer may break during substrate separation
Solution Approach 1:
The patent applies a flexible circuit board instead of a rigid substrate to carry the driving chip. The flexible circuit board can bend and deform elastically during the separation process, allowing the rigid driving chip pins to remain intact while the flexible substrate conforms to the curvature of the display panel. This resolves the contradiction by making the carrier flexible rather than rigid.
Solution Approach 2:
The patent introduces an intermediate layer (adhesive layer or encapsulation layer) between the flexible display panel and the driving chip assembly. This intermediate layer acts as a buffer and protector during the separation process, preventing direct contact and potential damage between the rigid pins and the flexible substrate edges. The intermediate layer absorbs mechanical stress and prevents pin breakage.
2Adaptability or versatility
If a rigid substrate is used for manufacturing, then manufacturing processes are simpler, but the flexible display panel cannot achieve proper flexibility and impact endurance
Solution Approach 1:
The patent replaces the traditional rigid glass substrate with a flexible substrate (such as plastic or metal thin plate) that can bend and deform. This flexible substrate serves as the base for forming the display panel while maintaining the ability to flex and withstand impact. The manufacturing process remains relatively simple by following conventional FPD fabrication steps but using flexible materials instead of rigid ones.
3Ease of manufacture
If the flexible display panel is separated from the rigid substrate, then the flexible display can be formed, but the driving chip pins and trace layers are prone to breaking
Solution Approach 1:
The patent uses a flexible circuit board that can elastically deform during the separation process. When the flexible display panel is separated from the rigid substrate, the flexible circuit board bends and conforms to the display panel's curvature without breaking the driving chip pins or trace layers. The flexible nature of the circuit board allows it to absorb the mechanical stress of separation while maintaining electrical connections.
Solution Approach 2:
The patent incorporates protective measures beforehand, such as using a flexible circuit board with sufficient thickness and strength to withstand separation forces, and potentially adding adhesive or encapsulation layers that protect the driving chip pins during the separation process. These preemptive protective measures prevent pin breakage before it can occur during substrate separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents pin breakage and enhances the overall structural reliability of flexible displays by allowing flexible circuit boards to absorb stress and providing a robust connection through sealing or hot-melt protective layers during substrate separation.
Implementation Method 1
an anisotropic conductive film disposed between the flexible circuit board and the bonding area of the flexible display panel, wherein the flexible circuit board is electrically connected to the flexible display panel via the anisotropic conductive film
Implementation Method 2
the anisotropic conductive film includes an adhesive and a plurality of conductive particles. The conductive particles are distributed in the adhesive
Implementation Method 3
a hot-melt protective layer covers the display area and the bonding area of the flexible display panel and a portion of the flexible circuit board
Implementation Method 4
performing a heating step to soften the hot-melt protective layer
Implementation Method 5
The sealing layer encapsulates a periphery of the flexible display panel and extendedly covers the bonding area and a portion of the flexible circuit board
Data Source
AI summary
A flexible display apparatus including a flexible display panel, a driving chip and a hot-melt protective layer is provided. The flexible display panel has a display area and a bonding area located outside the display area. The driving chip is disposed on the bonding area of the flexible display panel via at least one flexible circuit board. The hot-melt protective layer is disposed on the display area and a portion of the flexible circuit board. The hot-melt protective layer locates on a top surface of the flexible display panel.