Collective Mounting of Electronic Components on Unhardened Resin
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Solution Overview
Problem
Current methods for mounting electronic components on substrates are inefficient due to the need for sequential fixing of components, which increases production time and can result in defects from resin state changes during the bonding process.
Innovation Solution
A collective mounting method where multiple electronic components are simultaneously pressed and fixed to an unhardened resin layer, which is then heated to form an insulating layer, using isotropic pressure to prevent resin state changes and ensure uniform bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are fixed one by one using adhesive, then each component can be securely bonded, but the production time increases significantly
Solution Approach 1:
The patent merges multiple individual bonding operations into a single collective bonding operation. Multiple electronic components are simultaneously pressed and bonded to the substrate using a group pressing mechanism, replacing the traditional sequential one-by-one bonding process. This combining approach maintains bonding reliability while dramatically reducing production time and improving productivity.
Solution Approach 2:
The patent applies preliminary action by pre-positioning multiple electronic components on the substrate before collective bonding. The components are arranged in their final positions while the adhesive is still in an unhardened state, allowing subsequent collective pressing to secure all components simultaneously. This preliminary arrangement eliminates the need for repeated positioning and bonding operations.
2Manufacturing precision
If electronic components are pressed to unhardened resin layer for sufficient time, then bonding quality improves, but resin state changes and bonding defects occur
Solution Approach 1:
The patent implements continuous useful action by immediately hardening the resin layer after collective pressing. The pressing and hardening operations are performed in quick succession without interruption, ensuring that the resin maintains its bonding properties throughout the process. This continuous action prevents resin state changes and bonding defects while ensuring high bonding quality.
Solution Approach 2:
The patent rushes through the bonding process by minimizing the time the resin remains in an unhardened state. Multiple components are pressed and bonded in a single rapid operation, and the resin is immediately hardened afterward. This rushed approach prevents the resin from undergoing detrimental state changes while still achieving sufficient bonding pressure and quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for rapid and uniform fixation of electronic components without resin state changes, reducing production time and preventing bonding defects, thereby improving productivity and reliability.
Implementation Method 1
heating and hardening the unhardened resin to form an insulating layer
Data Source
AI summary
There is disclosed a collective mounting method of electronic components in which a plurality of electronic components can uniformly be pressed to an insulating layer in a short time in a case where the electronic components and a resin layer are fixed. To manufacture a semiconductor-embedded substrate 200 in which a plurality of semiconductor devices 220 are embedded, after disposing the plurality of semiconductor devices 220 on an unhardened resin layer 212, this is stored in a container 31 of a pressurizing and heating unit 3, the plurality of semiconductor devices 220 are simultaneously, collectively and isotropically pressurized by use of an internal gas in the container 31 as a pressure medium to simultaneously press the plurality of semiconductor devices 220 to the unhardened resin layer 212, and the resin layer 212 is heated and hardened. In consequence, the plurality of semiconductor devices 220 are collectively and uniformly fixed and mounted onto the resin layer 212 without being influenced by a state change of the resin layer 212.