PCB Edge Connector Cavities Preventing Dielectric Incursion

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Solution Overview

Problem

Existing methods for manufacturing multilayer printed circuit boards with edge connectors often result in dielectric material incursion onto conductors during lamination, affecting the reliability of electrical connections.

Innovation Solution

A method involving the use of cover members made from fluorosilicone or similar materials to prevent dielectric migration during lamination, followed by milling to create projecting edge portions or cavities for secure edge connector placement, utilizing conventional PCB equipment and processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional lamination processes are used without cover members, then the manufacturing process is simple, but dielectric material incursions onto conductors occur during lamination, affecting connection reliability

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

A cover member made of fluorosilicone material is introduced as an intermediary element between the dielectric layers during lamination. This cover member prevents dielectric material from incuring onto the conductors while allowing heat and pressure to pass through during the lamination process. The cover member is temporarily positioned and then removed after lamination, leaving clean conductor surfaces for reliable electrical connections.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The cover members are positioned on the conductors before the lamination process begins. This preliminary action protects the conductors from dielectric incursion during the subsequent lamination step. The cover members are pre-placed in the correct positions and then the lamination process is applied over them, ensuring conductor protection throughout the high-temperature, high-pressure process.

Inventive Principle:

Principle #10Preliminary action

2Adaptability or versatility

If edge portions are created for connector placement, then connector integration is improved, but additional milling steps increase manufacturing complexity

Engineering Contradiction:

Improveconnector integration capabilityVSAvoidmanufacturing process steps

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The PCB structure is segmented into distinct regions: main body portions and edge portions. The edge portions are created by selectively removing material only at the edges while leaving the center intact. This segmentation allows edge connectors to be placed on the edge portions without affecting the main circuit board structure, providing adapter functionality while using conventional milling equipment.

Inventive Principle:

Principle #1Segmentation

3Reliability

If cavities are formed for connector accommodation, then connector security is enhanced, but additional material removal increases manufacturing time

Engineering Contradiction:

Improveconnector securityVSAvoidmanufacturing cycle time

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

Cavities for accommodating edge connectors are formed in advance during the lamination process by positioning cavities within the dielectric layers before final lamination. This preliminary cavity formation eliminates the need for post-lamination drilling or milling operations. The cavities are created as part of the layer stacking process, and then the layers are laminated together, securing the cavities in place without requiring additional material removal steps.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures a secure and reliable electrical connection by preventing dielectric material from engaging conductors, enhancing the manufacturing process with cost savings and improved connector integration.

Implementation Method 1

positioned within openings in second and third circuitized substrates... preventing dielectric material from engaging conductors

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Implementation Method 2

The selected number of layers, including both conductive and dielectric, are laminated using conventional pressures and temperatures to form the multilayered structure

Methodology Applied

Scientific EffectLamination: Lamination

Implementation Method 3

milling to create projecting edge portions or cavities for secure edge connector placement

Methodology Applied

Scientific EffectAbrasion: Abrasion

Data Source

PatentUS7596863B2Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein

Publication Date: 2009.10.06 TTM TECHNOLOGIES NORTH AMERICA LLC

AI summary

A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each opening including a cover member located therein. During lamination, the cover members for a seal and prevent dielectric material (e.g., resin) liquefied during the lamination from contacting the conductive layers on the opposed surfaces of the inner (first) substrate. A PCB is thus formed with either a projecting edge portion or a plurality of cavities therein such that electrical connection may be made to the PCB using an edge connector or the like.