Packaging Substrate Conductive Posts Solder Caps
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Solution Overview
Problem
The binding force between the packaging substrate and the connecting substrate in chip packaging structures is limited due to small contact areas between solder balls and surfaces, making the structures prone to damage during transport or use, leading to malfunction and safety issues.
Innovation Solution
The method involves manufacturing a packaging substrate with conductive posts and solder caps that increase the contact area by forming copper plating layers and etching barrier patterns on a multilayer circuit board, ensuring reliable mechanical and electrical connections through solder balls that surround the entire circumferential surface of the posts and pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are used to connect packaging substrate and connecting substrate, then electrical connection is achieved, but binding force is limited due to small contact areas
Solution Approach 1:
The patent extends the connection from a two-dimensional point contact (solder ball) to a three-dimensional structure by adding conductive posts that protrude from the packaging substrate. This dimensional extension increases the contact area and improves mechanical binding force while maintaining electrical connectivity.
Solution Approach 2:
The connection structure is segmented into multiple components: solder balls for electrical connection, conductive posts for mechanical support, and solder caps for enhanced bonding. This segmentation allows each component to optimize its specific function, improving overall connection reliability.
2Strength
If contact area between solder balls and surfaces is increased, then binding force improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the functions of mechanical support and electrical connection into an integrated structure where conductive posts serve both purposes. This consolidation achieves enhanced binding force without proportionally increasing manufacturing complexity, as the posts are formed as part of the substrate structure.
Solution Approach 2:
The conductive posts are pre-formed on the packaging substrate before final assembly. This preliminary action allows the posts to be integrated into the substrate manufacturing process, reducing overall manufacturing complexity despite the added structural feature.
3Reliability
If conductive posts with solder caps are formed, then contact area and connection reliability improve, but manufacturing steps increase
Solution Approach 1:
The conductive posts serve multiple functions: mechanical support, electrical connection, and bonding surface for solder caps. This multi-functionality reduces the need for separate components and steps, offsetting the increased manufacturing complexity with functional consolidation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of the chip packaging structure by increasing the contact area between chips and substrates, preventing damage and ensuring normal operation and safety even when the structure is handled or used.
Implementation Method 1
a plating layer 140, 170 is formed on the first conductive pattern layer 112 and the second conductive pattern layer 113
Implementation Method 2
a plating layer 140, 170 is formed on the first conductive pattern layer 112 and the second conductive pattern layer 113
Implementation Method 3
The packaging substrate is mechanically and electrically connected to the connecting substrate through a number of solder balls
Data Source
AI summary
A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.