Acceleration Sensor Torsion Beam Thickness Optimization

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Solution Overview

Problem

Existing acceleration sensors for reflective elastic wave exploration in underground resources exploration face challenges in achieving high sensitivity while maintaining a low manufacturing cost, as reducing the spring constant requires expensive equipment and increased chip size, making it difficult to provide a highly sensitive sensor at a low price.

Innovation Solution

The acceleration sensor design includes a membrane with a stacking structure and torsion springs formed from a conductive layer, where the springs have a width smaller than their thickness and length, allowing for a decrease in spring constant without narrowing the beam width or lengthening it, thereby achieving high sensitivity and downsizing the chip without increasing manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the spring constant of the beam is reduced by narrowing the width or lengthening the beam, then the sensitivity for vertical acceleration is improved, but the manufacturing cost increases or the chip size increases

Engineering Contradiction:
ImprovesensitivityVSAvoidmanufacturing cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent changes the parameter of beam thickness (making it thinner than the membrane thickness) to reduce the spring constant. This allows sensitivity improvement without requiring expensive narrow-beam equipment or increasing chip size, as the thickness parameter can be controlled through standard microfabrication processes.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

Instead of reducing beam width (x-axis) or increasing beam length (y-axis), the patent reduces beam thickness (z-axis). This dimensional shift allows spring constant reduction through a parameter that does not directly impact chip footprint or require specialized manufacturing equipment.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If the spring constant of the beam is reduced by narrowing the width of the beam, then the sensitivity for vertical acceleration is improved, but the manufacturing apparatus cost increases

Engineering Contradiction:
ImprovesensitivityVSAvoidmanufacturing apparatus
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent changes the parameter of beam thickness (making it thinner than the membrane thickness) to reduce the spring constant. This allows sensitivity improvement without requiring expensive narrow-beam equipment or increasing chip size, as the thickness parameter can be controlled through standard microfabrication processes.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If the beam length is increased to decrease the spring constant, then the sensitivity is improved, but the chip size increases

Engineering Contradiction:
ImprovesensitivityVSAvoidchip size
Core Design Contradiction:
Measurement precisionVSLength of stationary object

Solution Approach 1:

The patent changes the parameter of beam thickness (making it thinner than the membrane thickness) to reduce the spring constant. This allows sensitivity improvement without requiring expensive narrow-beam equipment or increasing chip size, as the thickness parameter can be controlled through standard microfabrication processes.

Inventive Principle:
Principle #35Parameter changes

4Ease of manufacture

If the beam thickness is equalized to the membrane thickness, then the manufacturing is simplified, but the spring constant cannot be sufficiently reduced

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidsensitivity
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent applies different thickness values to different components: the beam thickness is made smaller than the membrane thickness. This local differentiation allows the beam to have sufficiently small spring constant while the membrane maintains its required structural properties.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the sensitivity and performance of the acceleration sensor while reducing manufacturing costs, allowing for the production of highly sensitive sensors at a lower price by microfabricating the sensor with a short beam length and maintaining accuracy through even thickness formation of the torsion springs.

Implementation Method 1

a capacitance detecting sensor including a membrane (1) having a stacking structure and a plurality of beams (2T1, 2T2) capable of twisting so that the membrane (1) is movable in a detecting direction

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS10802041B2Acceleration sensor
Publication Date: 2020.10.13 HITACHI LTD
  • US10802041B2 patent drawing
  • US10802041B2 patent drawing
  • US10802041B2 patent drawing

AI summary

In an acceleration sensor detecting a vibration acceleration by using torsion of a beam joining a fixed portion and a membrane, a spring constant of the beam is decreased while an increase in a chip size due to extension of the beam is prevented, so that an acceleration sensor that is highly sensitive and small in a size is provided with a low price. A sensor of a capacitance detecting type includes a membrane having a stacking structure formed of two or more layers and a plurality of beams capable of twisting so that the membrane is movable in a detecting direction, a first beam of the plurality of beams is formed of the same layer as either an upper or a lower layer of the membrane, and a second beam thereof is formed of the same layer as either an upper or a lower layer of the movable portion.