Acceleration Sensor Surface Mounting via Conductive Spring
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Solution Overview
Problem
Existing acceleration sensors are complex, costly, and not surface mountable, limiting their integration with circuit boards without wires.
Innovation Solution
A simplified acceleration sensor design featuring a minimal number of cooperating parts, including conductive end caps and a central non-conductive member with a conductive spring, allowing for easy assembly and surface mounting by maintaining electrical conductivity through the spring's displacement in response to acceleration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional acceleration sensor designs are used, then sensing functionality is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple functional elements into a single integrated sensor assembly. The sensor housing, sensing element, and electrical connection components are merged into one unit that can be directly mounted on circuit boards, eliminating the need for separate mounting brackets, wiring harnesses, and additional fastening components.
Solution Approach 2:
The sensor housing serves multiple functions simultaneously: it provides mechanical protection for the sensing element, acts as a mounting structure for direct PCB attachment, and incorporates electrical contact elements. This multi-functionality reduces the overall component count while maintaining sensing capability.
2Reliability
If traditional acceleration sensor designs are used, then sensing functionality is achieved, but manufacturing cost increases
Solution Approach 1:
By merging protection, mounting, and electrical connection functions into a single housing structure, the patent reduces the total number of parts that need to be manufactured, inventoried, and assembled. This consolidation lowers manufacturing complexity and associated costs.
Solution Approach 2:
The sensor is designed as a modular surface-mountable unit that can be manufactured using standard PCB fabrication techniques and then directly attached to circuit boards. This segmentation from traditional through-hole mounting designs enables more efficient manufacturing workflows and reduced assembly costs.
3Reliability
If traditional acceleration sensor designs are used, then sensing functionality is achieved, but surface mounting capability is lost
Solution Approach 1:
The patent transitions from traditional three-dimensional through-hole mounting to a two-dimensional surface-mount configuration. The sensor housing is designed with a flat profile that sits directly on the PCB surface, with electrical contacts made through conductive adhesives or solder paste, enabling placement in the XY plane rather than requiring Z-axis penetration.
Solution Approach 2:
The housing is designed to serve as both the protective enclosure and the mounting structure for surface attachment. Integrated mounting features such as adhesive pads or mechanical tabs are incorporated into the housing design, allowing direct attachment to PCB surfaces without additional mounting components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces complexity and cost while enabling surface mounting on circuit boards, enhancing integration and usability of acceleration sensors.
Implementation Method 1
the spring's displacement in response to acceleration
Data Source
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AI summary
An acceleration sensor is provided. The acceleration sensor contains a first electrically conductive element and a second electrically conductive element. An electrically insulative element is connected to the first electrically conductive element and the second electrically conductive element, where at least a portion of the first electrically conductive element and at least a portion of the second electrically conductive element make contact with the electrically insulative element. At least one electrically conductive spring is located within a cavity of the sensor, wherein the cavity is defined by at least one surface of the first electrically conductive element, at least one surface of the electrically insulative element, and at least one surface of the second electrically conductive element.