Acceleration Sensor Module Housing with Press-Fit Pins
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Solution Overview
Problem
The widespread production of electronic sensors relies on costly assembly processes involving printed circuit boards and soldering, limiting marketability and requiring lead in sensor production, while existing technologies without substrates are complex and expensive.
Innovation Solution
A sensor design featuring a module housing with laterally projecting connection pins and a metal carrier strip providing spring-clamping contact points, allowing for press-in technology integration without a printed circuit board, using standard dual inline package (DIP) with minor modifications and overmolding with plastic, enabling cost-effective production and customization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If standard SMD processes with printed circuit boards are used, then reliable electrical connections are achieved, but production costs increase and lead usage is required
Solution Approach 1:
The invention extracts and eliminates the printed circuit board from the sensor assembly, directly mounting the module housing with connection pins into the sensor housing. This removes the unnecessary intermediary substrate while maintaining reliable electrical connections through direct press-fit mounting, thereby reducing production costs and eliminating lead requirements.
Solution Approach 2:
The invention merges the module housing directly into the sensor housing structure, combining previously separate components (PCB, module housing, sensor housing) into an integrated assembly. This consolidation eliminates the need for separate electrical connection layers and reduces manufacturing steps, achieving both reliability and cost reduction.
2Ease of manufacture
If printed circuit boards are used as carriers, then electrical connections and component mounting are facilitated, but device complexity and production costs increase
Solution Approach 1:
The invention removes the printed circuit board carrier from the assembly, eliminating the complex multi-layer electrical connection structure. Instead, simple connection pins are directly pressed into corresponding receptacles in the sensor housing, dramatically simplifying the assembly structure while maintaining ease of manufacture through standardized press-fit processes.
3Ease of manufacture
If standard DIP packages are used without modification, then production with standard machines is possible, but integration into sensor housing is not achievable
Solution Approach 1:
The invention applies local quality by making minimal, targeted modifications to the DIP package - specifically adding connection pins at specific locations on the module housing - while keeping the rest of the package structure standard. This allows the modified DIP to be integrated into the sensor housing via press-fit mounting, achieving both cost-effectiveness through standard production and adaptability through customized integration points.
4Object-affected harmful factors
If soldering technology is converted to lead-free solders, then environmental requirements are met, but development costs and process complexity increase
Solution Approach 1:
The invention replaces the thermal soldering process with a mechanical press-fit mounting system. Connection pins are directly pressed into corresponding receptacles without requiring solder, eliminating the need for lead-free solder development and associated process complexity while meeting environmental requirements by completely avoiding solder materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs, eliminates the need for lead, and allows for flexible sensor design without altering existing production matrices, ensuring reliable electrical and mechanical integration while avoiding thermal stress and contamination issues.
Implementation Method 1
a spring-clamping contact point, which forms a flexible press-fit zone for the corresponding connection pin
Data Source
Figure 1A~1C
Figure 2
Figure 3
AI summary
In an electronic sensor or sensor device, in particular acceleration sensor, comprising a sensor housing (16) with a chip module (2) and module housing (1) mounted therein, it is proposed that the module housing (1) comprise connecting pins (4) that protrude outward to the side, each of said pins having a narrowing (3) at the respective end thereof. Also, at least one metallic support strip (7) is provided, one end area of which is designed as a plug contact (8) and a second end area of which comprises a spring-clamp contact point (9) for at least one connection pin (4), respectively, said spring-clamp contact point forming a flexible inward pressing zone for the corresponding connection pin (4).