Printed Circuit Assembling TRIZ Cases

Phosphorus-modified copper particles in solder paste form Cu3P intermetallics, increasing shear strength at 200°C and connection stability.

Anisotropically conductive film electrically connects LED chip electrodes to circuit board metallization layers.

Compressed gas drives the plunger to adjust discharge speed without changing stroke length, solving viscosity handling challenges in liquid material processing.

A modified semiaromatic polyamide composition reduces water absorption to maintain dimensional stability during lead-free reflow soldering.

Interspaced pin columns contain conductive particles to prevent short circuits between adjacent structures.

A four-layer copper foil with carrier structure enables clean separation of build-up wiring layers without residual metal contamination.

Orienting capacitors with complementary signals cancels piezoelectric vibrations, reducing audible noise on circuit substrates.

Deforming a protruding element creates a crimping bead that secures the chip in fabric, eliminating complex thread attachment steps.

A mounting target working device uses a universal head unit to place components on flat plate-shaped and three-dimensional targets.

A sensor module housing uses laterally projecting connection pins to enable direct press-in mounting into a sensor housing without printed circuit boards.

A resin layer defines a cavity to house functional units without copper plating.

A solder spacer uses a centering peg with an outer passage to guide molten solder via capillarity for strong fastening.

Metal through electrodes connect peripheral pads to central cores via conductive adhesive film, preventing voltage drops in multi-core BGA packages.

Edge-aligned contact tabs on a flexible smart card join garment conductors, replacing rigid housings that compromise comfort.

Pre-testing multilayer wiring on separate substrates before embedding components eliminates via defects and short circuits during assembly.

A field programmable solder ball grid array module applies localized heating to specific substrate regions.

A suction-based holding member positions a film over electrical connections on liquid ejecting heads, preventing film shifting during sealant curing.

Conductive glue joins out-cell device leads to display device leads, eliminating separate flexible printed circuit boards and reducing production costs.

Segmented leadframe with flanges increases bonding area, preventing glue cracking and delamination during stress testing.

Rotating contact grids prevents Conductive Anodic Filament growth by ensuring adjacent pins intersect different glass fiber bundles.

Consolidated solder islands reinforce BGA packages against mechanical shock and prevent dislodgement during board level vibration.

Laser ablation creates precise trenches for embedded bias and signal traces in dielectric substrates.

A capacitive micromachined ultrasonic transducer uses an insulation layer on the substrate to electrically isolate the flexible printed circuit board connection.

Protrusions on shunt resistor lateral surfaces bond with solders to stabilize resistance values and eliminate measurement errors from attachment variability.

Segmented thermally-insulative inserts and nested conductive shells enable precise temperature monitoring during tissue ablation.

Conductive bumps penetrate uncured synthetic resin to join actuator electrodes and printed wiring board terminals.

Independent Y-axis drives enable separate pot movement, resolving synchronous motion limits and improving processing flexibility.

A bussed electrical center uses a conductive connector ring pressed against a power cable terminal end by tightening housing fasteners.

A circuit board element integrates a channel-shaped waveguide cavity to route light from an LED directly to a photodiode for on-board detection.

Segmenting the contact element eliminates soldering and cleaning steps, reducing assembly complexity.

A seal ring inductor operates as a coil to provide inductance and electrostatic discharge protection.

A high-frequency signal line divides into linear portions to pack closer on a mother laminate.

A printed wiring board manufacturing method positions electronic components using alignment marks to form precise via conductors.

A flexible electrically conductive adhesive transfer tape forms a Faraday shield over a photodetector.

A printed wiring board embeds conductor pads within resin layers to enable fine-pitch connections.

A photodetector module uses a dielectric plate to cancel amplifier capacitance for impedance matching.

Segmenting the shell conductor into a cover and main body allows routing thick shield wires without rattles, securing components with a bolt seal.

A production method for electronic chip components uses an adhesive substrate and elastic slider to position ceramic bodies during paste application.

Metal-containing conductive particles adhesinally wet transparent metal oxide electrodes, preventing ITO corrosion and reducing electrical resistance.

Vertical conductive vias connect corner inductors to power management integrated circuits on a substrate surface.

An electric switch integrates a latching lug and resilient detent to secure the component on a printed circuit board opening.

A shielding connector uses mechanical holding and microwave absorbers to surround electrical conductors without soldering.

Connection terminals use variable line width pads to reduce contact resistance.

Reaction particles form localized insulation layers on solder legs, preventing dendrite corrosion without complex board-wide coating processes.

A mounting system allocates equipment units based on use permission status to ensure functional resources are available for manufacturing lots.

A composite wiring substrate joins build-up and interposer layers using a segmented joint material with distinct copper-tin and tin-bismuth alloy portions.

Composite polymer-metal contacts reduce parasitic effects and impedance mismatch at fine pitch through controlled impedance design.

Protruding portions on a solder-printing stencil absorb squeegee pressure, protecting delicate mini-LED circuitry from mechanical damage and short circuits.

Segmented side-surface electrodes in a multilayer ceramic capacitor minimize equivalent series inductance by enabling multiple parallel current routes.

Embedding a second circuit structure in a receiving cavity reduces thickness and cost while maintaining signal integrity through local quality segmentation.