Resin Cavity Packaging Eliminates Copper Shell for MEMS
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Solution Overview
Problem
Conventional electronic components with copper plating layers for MEMS devices require complex shell structures and processes, limiting design flexibility and introducing issues like floating capacitance, which are not addressed by existing resin potting technologies.
Innovation Solution
A resin packaging method that eliminates the need for a copper plating layer by using a resin layer with a cavity and recesses to house the functional unit, allowing for direct solder connection and sealing without a shell structure, enabling transfer molding or compression molding without external pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a copper plating layer with shell structure is used to maintain the cavity, then the cavity can tolerate external pressure during transfer molding or compression molding, but the device complexity increases and design flexibility is limited
Solution Approach 1:
The invention extracts and removes the copper plating layer shell structure from the packaging system. Instead of using a separate copper shell to maintain the cavity, the patent uses a resin layer that directly forms the cavity through its own structural design, eliminating the need for the copper plating layer entirely.
Solution Approach 2:
The invention merges the cavity maintenance function with the resin layer itself. The resin layer is designed to directly form and maintain the cavity structure without requiring a separate copper shell, combining what were previously separate functions into a single integrated component.
2Reliability
If a copper plating layer is used to define the cavity, then the cavity structure is maintained, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The invention extracts the cavity formation function from the copper plating layer process and transfers it to the resin layer. This eliminates the need for copper plating layer formation steps in the manufacturing process, reducing process time and complexity.
Solution Approach 2:
The resin layer is designed and configured in advance to directly form the cavity structure. By preparing the resin layer with the appropriate cavity-forming structure before packaging, the need for subsequent copper plating layer formation is eliminated, streamlining the manufacturing process.
3Reliability
If a copper plating layer shell structure is used, then the cavity is maintained under external pressure, but the overall height of the electronic component increases
Solution Approach 1:
The invention removes the copper plating layer shell structure that added height to the component. The resin layer is designed to provide the necessary cavity maintenance function without the additional height imposed by a separate copper shell structure.
Solution Approach 2:
The resin layer acts as a flexible structure that can maintain the cavity under external pressure during transfer molding or compression molding without requiring the rigid, height-increasing copper shell. The resin's flexibility allows it to withstand pressure while maintaining a compact profile.
Data Source
AI summary
A method of manufacturing an electronic device includes preparing an electronic component including a first substrate on a main surface of which a functional unit and a first resin layer are formed. The first resin layer has a first surface facing the main surface of the first substrate, a second surface opposed to the first surface, a cavity on the first surface enclosing the functional unit, and a portion defining a wall of the cavity. The first resin layer defines a recess provided with a solder layer on the second surface. The method further includes preparing a second substrate having an electrode pad formed on a main surface, aligning the electronic component with the second substrate to layer the solder layer and the electrode pad in contact with the solder layer, and forming the electronic component and the second substrate into the electronic device.