Printed Wiring Board Manufacturing with Embedded Components
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Solution Overview
Problem
Existing methods for manufacturing electronic modules with copper foil conductive layers face issues such as warping, which leads to wiring breakage and reduced connection reliability due to the instability of thin copper foils and the inability to form fine-pitch wiring with thick copper foils.
Innovation Solution
A method involving a multilayer substrate with insulation layers and a conductive film, where alignment marks are used to precisely position and enclose electronic components, forming via holes and conductive circuits to connect terminals without direct contact with the conductive film, thereby minimizing warping and enhancing connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thin copper foil is used for the conductive layer, then fine-pitch wiring can be formed, but the copper foil is not firm and is easy to warp causing wiring breakage
Solution Approach 1:
The patent uses a composite structure consisting of a flexible copper foil conductive layer combined with a rigid support substrate. The copper foil is laminated onto the support substrate, creating a composite material that combines the electrical conductivity and flexibility of copper with the dimensional stability and rigidity of the support substrate, thereby preventing warping while maintaining fine-pitch wiring capability
Solution Approach 2:
The support substrate acts as an intermediary between the thin copper foil and the final product. It provides mechanical support and stability to the thin copper foil, preventing warping and wiring breakage, while allowing the copper foil to maintain its electrical conductivity and fine-pitch wiring characteristics
2Strength
If thick copper foil is used for the conductive layer, then wiring strength is improved, but fine-pitch wiring cannot be formed by etching
Solution Approach 1:
The patent creates a composite structure where a thin copper foil (capable of fine-pitch wiring) is combined with a rigid support substrate. The support substrate provides the necessary strength and stability that would otherwise require thick copper foil, while the thin copper foil maintains the ability to form fine-pitch wiring patterns
3Reliability
If copper foil is used for the conductive layer, then electrical conductivity is achieved, but the copper foil warps during thermosetting causing wiring breakage
Solution Approach 1:
The patent forms a composite material by laminating the copper foil conductive layer onto a support substrate. This composite structure maintains the electrical conductivity of the copper foil while the support substrate provides dimensional stability and prevents warping during thermosetting and other manufacturing processes
Solution Approach 2:
The support substrate serves as an intermediary that stabilizes the copper foil during thermosetting. It prevents the copper foil from warping due to thermal shrinkage of the resin, thereby maintaining the flatness and integrity of the wiring patterns throughout the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the productivity and reliability of printed wiring boards by preventing wiring breakage and connection failures, allowing for precise alignment and robust electrical connections, while maintaining the flatness of the substrate.
Implementation Method 1
A surface of the conductive film and a surface of the via hole are plated to form a via conductor in the via hole and to form a conductive layer on the conductive film
Data Source
AI summary
A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.