Embedded High-Frequency Circuit Board for Signal Integrity
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Solution Overview
Problem
Traditional high-frequency circuit boards face challenges in managing high-frequency signals due to increased thickness and cost, as well as signal interference as circuit density increases, necessitating improved manufacturing methods to meet the demands of 4G/5G transmission technology and digital wireless processing.
Innovation Solution
A method for manufacturing high-frequency circuit boards involves embedding second circuit structures within a receiving cavity of a first circuit structure, using high-frequency materials for the substrate layers, and forming dielectric and conductive layers to reduce electromagnetic interference, with additional support columns for enhanced structural integrity and signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-frequency materials are used to make the circuit board, then high-frequency signal transmission is improved, but thickness and cost increase
Solution Approach 1:
The circuit board is divided into multiple layers with different functions: first and second circuit boards for signal transmission, dielectric layers for insulation, and metal layers for grounding and shielding. This segmentation allows each layer to be optimized independently, achieving high-frequency performance without requiring the entire board to be thick high-frequency material.
Solution Approach 2:
The patent embeds the second circuit board within the first circuit board structure, with the second circuit board positioned between the first circuit board and the dielectric layer. This nested arrangement maximizes space utilization and reduces overall thickness while maintaining signal integrity.
2Reliability
If high-frequency materials are used to make the circuit board, then high-frequency signal transmission is improved, but cost increases
Solution Approach 1:
High-frequency materials are applied locally only where signal transmission is critical (first and second circuit boards), while other areas use standard materials (dielectric layers, metal ground layers). This local quality approach reduces overall material cost while maintaining high-frequency performance where needed.
Solution Approach 2:
The circuit board uses a composite structure combining high-frequency materials with standard dielectric and metal materials. This composite approach balances performance requirements with cost considerations, using expensive materials only where necessary for high-frequency signal integrity.
3Adaptability or versatility
If circuit density increases, then functionality is improved, but signal interference between circuits increases
Solution Approach 1:
Dielectric layers and metal ground layers serve as intermediaries between circuit elements, providing electrical isolation and shielding. These intermediary layers prevent signal interference while allowing high circuit density by maintaining proper spacing and grounding without requiring excessive physical distance between circuits.
Solution Approach 2:
The patent utilizes the vertical dimension by stacking multiple circuit boards and dielectric layers to create a three-dimensional circuit architecture. This vertical arrangement allows high circuit density while maintaining signal integrity through proper layering and grounding, effectively separating circuits in the vertical dimension to reduce interference.
Data Source
AI summary
A high-frequency circuit board includes a first circuit structure, a second circuit structure, and a dielectric layer formed on the second circuit structure. The first circuit structure includes a first substrate layer and at least one first circuit layer. The at least one first circuit layer is formed on at least one surface of the first substrate layer. At least one receiving cavity is defined in the first substrate layer. A second circuit structure is embedded in the receiving cavity. The second circuit structure includes a second substrate layer, at least one second circuit layer embedded in the second substrate layer, and a plurality of support columns formed on the second substrate layer. A portion of the dielectric layer is filled into gaps between an inner wall of the receiving cavity and the second circuit structure. The support columns are embedded in the dielectric layer.