Semiconductor Chip Power Distribution via Through-Electrodes
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Solution Overview
Problem
In semiconductor integrated circuit devices, particularly in BGA packages with multi-core processors, the increased power consumption leads to insufficient power supply at the peripheral pads, resulting in significant power voltage drops due to the inability to arrange power supply pads centrally, and miniaturizing the organic wiring board increases costs.
Innovation Solution
A semiconductor integrated circuit device design where a semiconductor chip is mounted face-up on a multi-layer organic interposer, utilizing a first group of metal through electrodes to supply power to the core circuit and interconnected with a conductive adhesive member film to a metal land on the interposer, ensuring efficient power distribution and avoiding voltage drops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power supply pads are arranged only at the peripheral portion of the chip, then the chip structure is simple, but power supply voltage drop becomes remarkable in the central portion
Solution Approach 1:
The power supply system is segmented into multiple independent paths: peripheral power supply pads connect to through-electrodes that extend vertically to supply power at the chip center, while additional power supply pads are provided at the peripheral portion. This segmentation allows power to be delivered through multiple routes, preventing voltage drops in the central region without requiring a completely complex chip restructuring.
Solution Approach 2:
The solution transitions from a two-dimensional peripheral pad arrangement to a three-dimensional power distribution network by incorporating through-electrodes that extend vertically through the chip. This dimensional change allows power supply pads to effectively reach the central portion of the chip without increasing the planar footprint or complicating the surface layout.
2Area of stationary object
If the organic wiring board is miniaturized to accommodate the chip, then the device size is reduced, but manufacturing cost is greatly increased
Solution Approach 1:
The organic wiring board is designed with multi-functionality: it serves both as a mechanical support substrate and as an electrical interconnection network. The through-electrodes and conductive adhesive members integrate power distribution, signal transmission, and mechanical bonding functions into a single standardized component, allowing cost-effective mass production while maintaining compact dimensions.
3Productivity
If multiple CPU cores and GPUs are integrated, then processing capability is improved, but wiring complexity increases causing portions where power supply pads cannot be arranged
Solution Approach 1:
Through-electrodes serve as intermediary elements that bridge the peripheral power supply pads and the central processing units. These vertical conductors act as mediators, transporting power from the easily accessible peripheral region to the densely packed central cores and GPUs, thereby enabling high processing capability without requiring complex wiring arrangements at the chip surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents undesired power supply voltage drops in partial regions of the semiconductor chip, ensuring stable power delivery to both internal and I/O circuit regions without the need for central power supply pads, thus reducing costs and improving performance.
Implementation Method 1
a first group of metal through electrodes... and a first metal land... are interconnected by a first conductive adhesive member film
Data Source
AI summary
A semiconductor integrated circuit chip, in which multi-core processors are integrated, is usually mounted over an organic wiring board by FC bonding to form a BGA package by being integrated with the substrate. In such a structure, power consumption is increased, and hence the power supplied only from a peripheral portion of the chip is insufficient, so that a power supply pad is also provided in the chip central portion. However, because of an increase in the wiring associated with the integration of a plurality of CPU cores, etc., there occurs a portion between the peripheral portion and the central portion of the chip, where a power supply pad cannot be arranged. According to the outline of the present application, in a semiconductor integrated circuit device such as a BGA, etc., in which a semiconductor chip is mounted over an interposer, such as a multilayer organic wiring board, in a face-up manner, a first group of metal through electrodes, which are provided in the semiconductor chip to supply a power supply potential to a core circuit, etc., and a first metal land over the interposer are interconnected by a first conductive adhesive member film.