Electronic Chip Component Production Method Using Adhesive Substrate and Elastic Slider
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Solution Overview
Problem
The existing production methods for electronic chip components, such as monolithic ceramic capacitors, require multiple holding jigs and suffer from low production yield due to the weak adhesive force of silicon rubber, leading to difficulties in handling and maintaining the ceramic body during the formation of external electrodes.
Innovation Solution
A production method involving a substrate with an adhesive surface and a slider with an elastic and irregular surface to securely turn and position the ceramic body, eliminating the need for multiple jigs and ensuring high reliability in forming conductive paste layers on the end surfaces without falling off, thereby enhancing production yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple holding jigs are used to form external electrodes, then the production method can accommodate the process requirements, but the device complexity increases and handling reliability decreases
Solution Approach 1:
The patent combines multiple holding jigs into a single integrated holding jig that can simultaneously hold the ceramic body at multiple positions. This single jig includes multiple holding portions that can secure the ceramic body during different processing steps, eliminating the need to transfer the ceramic body between multiple separate jigs and reducing overall device complexity.
Solution Approach 2:
The holding jig is designed with multi-functionality to perform multiple tasks: it can hold the ceramic body in different orientations, support paste application, and maintain the ceramic body during firing. This universal design replaces the need for multiple specialized jigs, simplifying the overall system while maintaining process feasibility.
2Reliability
If silicon rubber adhesive is used in holding jigs, then the ceramic body can be held initially, but the adhesive force decreases with time leading to production yield issues
Solution Approach 1:
The patent changes the adhesive parameter from time-dependent silicon rubber adhesive to heat-activatable adhesive. This adhesive remains inactive at room temperature and only activates at high temperatures during the firing process, maintaining strong holding force throughout the entire production cycle without degradation over time.
Solution Approach 2:
The holding jig is designed to hold the ceramic body securely during paste application while the adhesive remains inactive. The strong holding force is activated preliminarily during the firing process when heat is applied, ensuring the ceramic body remains firmly held during the critical firing stage without any adhesive degradation.
3Productivity
If the ceramic body is transferred between different holding jigs, then both end surfaces can be processed, but the ceramic body may fall off or be left behind reducing production yield
Solution Approach 1:
The patent merges multiple holding functions into a single holding jig that can process both end surfaces of the ceramic body without requiring transfer to another jig. The single jig includes multiple holding portions that can securely hold the ceramic body in different positions, allowing both end surfaces to be processed sequentially in one location, eliminating transfer-related failures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the efficient and reliable formation of electronic chip components with high production yield by preventing the ceramic body from falling off during processing, reducing the need for multiple jigs and managing adhesive forces, thus improving handling and production efficiency.
Implementation Method 1
a sticking step of sticking the second end surface of the electronic component body onto a substrate having an adhesive surface
Implementation Method 2
a slider with an elastic and irregular surface to securely turn and position the ceramic body
Implementation Method 3
a slider with an elastic and irregular surface to securely turn and position the ceramic body
Data Source
AI summary
A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.