Composite Polymer-Metal Contacts for Fine Pitch Signal Integrity

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Solution Overview

Problem

Traditional IC sockets face mechanical and electrical limitations due to increased terminal count, reduced terminal pitch, and signal integrity demands, leading to parasitic effects and housing warpage, which are not adequately addressed by current contact designs.

Innovation Solution

Composite polymer-metal contact members with a resilient polymeric base layer and metalized traces, using additive printing to create conductive paths and enhance spring constant, allowing for solder-free connections and improved impedance tuning, reducing parasitic effects and impedance mismatch.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional metal contact members are used, then electrical conductivity is achieved, but parasitic effects and signal integrity issues occur at fine pitch

Engineering Contradiction:
Improvesignal integrityVSAvoidparasitic effects
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent uses a composite structure combining polymer material with metal traces. The polymer substrate provides mechanical support and electrical isolation, while embedded metal traces provide controlled impedance electrical pathways. This composite approach eliminates parasitic effects from solid metal contacts while maintaining signal integrity through controlled impedance design.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The contact member features localized metal traces only where electrical connection is needed, rather than using solid metal throughout. The metal traces are precisely positioned and sized to provide necessary electrical pathways while minimizing parasitic effects. The polymer material provides electrical isolation in non-conductive areas.

Inventive Principle:
Principle #3Local quality

2Productivity

If terminal pitch is reduced to increase terminal count, then integration density is improved, but manufacturing precision and housing warpage become critical issues

Engineering Contradiction:
Improveterminal count densityVSAvoidpitch accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent changes the material parameter from solid metal to a polymer composite structure, which fundamentally alters the mechanical and thermal properties. The polymer material has lower thermal mass and different thermal expansion characteristics, reducing susceptibility to warpage during reflow processing. The flexible polymer substrate also provides compliance that accommodates minor pitch variations.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If copper based alloys are used for contact members, then electrical conductivity is achieved, but oxidation and material selection compromises occur

Engineering Contradiction:
Improveelectrical conductivityVSAvoidoxidation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The polymer material serves as an intermediary that protects the metal traces from oxidation and environmental degradation. The metal traces are embedded within or coated by the polymer, which acts as a protective barrier against oxygen and moisture, eliminating the need for complex plating systems while maintaining electrical conductivity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables next-generation electrical performance with fine pitch contact members, low profiles, and reduced complexity, allowing for reliable and high signal performance without the need for reflow soldering, while being environmentally friendly and cost-effective.

Implementation Method 1

The resilient polymeric base layer, the metalized layer, and the conductive plating have an aggregate spring constant sufficient to maintain distal portions of the contact members in a cantilevered configuration and to form a stable electrical connection

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS9277654B2Composite polymer-metal electrical contacts
Publication Date: 2016.03.01 LCP MEDICAL TECHNOLOGIES LLC
  • US9277654B2 patent drawing
  • US9277654B2 patent drawing
  • US9277654B2 patent drawing

AI summary

An array of composite polymer-metal contact members adapted to form solder free electrical connections with a first circuit member. The contact members include a resilient polymeric base layer and an array of metalized traces printed on selected portions of the base layer. Conductive plating is applied to the metalized layer to create an array of conductive paths. The resilient polymeric base layer, the metalized layer, and the conductive plating have an aggregate spring constant sufficient to maintain distal portions of the contact members in a cantilevered configuration and to form a stable electrical connection between the distal portions and the first circuit member solely by compressive engagement.