Semiconductor Connection Terminals with Variable Line Widths

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Solution Overview

Problem

High contact resistance between connection terminals and flexible printed circuits in display devices leads to voltage drops and defective displays, particularly due to misalignment and increased resistance in power supply lines.

Innovation Solution

The use of connection terminals with a combination of connection pads of different line widths and pitches, connected via wires or electrodes through contact holes, to reduce contact resistance to 5Ω or less, ensuring stable power supply to pixel and peripheral driver circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If connection terminals with single line width connection pads are used, then the structure is simple, but contact resistance increases to 10Ω or more due to misalignment

Engineering Contradiction:
Improvecontact resistanceVSAvoidconnection terminal structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The connection terminal is divided into multiple connection pads with different line widths (first connection pads with wider width and second connection pads with narrower width). This segmentation allows the terminal to handle misalignment more effectively by providing multiple contact points, reducing contact resistance to 5Ω or less while maintaining structural manageability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the connection terminal are assigned different line widths based on their functional requirements. The first connection pads have wider line widths for primary power supply connections requiring lower resistance, while second connection pads have narrower line widths for signal connections. This local differentiation optimizes both electrical performance and alignment tolerance.

Inventive Principle:
Principle #3Local quality

2Reliability

If power supply lines with high resistance are used, then the device complexity is reduced, but voltage drop increases causing defective display

Engineering Contradiction:
Improvedisplay qualityVSAvoidpower supply line structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Multiple power supply lines are merged into a composite power supply structure where first power supply lines with wider line widths are combined with second power supply lines. This merging reduces the overall resistance of the power supply path, suppressing voltage drops that would otherwise cause defective display, while maintaining a manageable structural configuration.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The line width parameter of power supply lines is changed and optimized - first power supply lines are designed with wider line widths to reduce resistance for high-current power supply paths, while second power supply lines use narrower widths where appropriate. This parameter optimization directly addresses voltage drop issues without excessive structural complexity.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If connection pads with uniform line widths are used, then manufacturing is simplified, but misalignment causes increased contact resistance

Engineering Contradiction:
Improvecontact resistance stabilityVSAvoidconnection terminal fabrication
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The connection terminal employs asymmetric line width design where first connection pads have wider line widths and second connection pads have narrower line widths. This asymmetric configuration provides tolerance against misalignment during assembly, ensuring stable contact resistance of 5Ω or less even when perfect alignment is not achieved, while remaining manufacturable with standard fabrication processes.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively decreases the resistance of power supply lines, suppresses voltage drops, and prevents defective displays by maintaining a low contact resistance even with misalignment, ensuring reliable operation of display devices.

Implementation Method 1

the electrode (connection pad) of a connection terminal is electrically connected to an electrode (FPC pad) of a flexible printed circuit terminal with an anisotropic conductive film or the like by thermocompression bonding

Methodology Applied
Scientific EffectThermocompression bonding:

Data Source

PatentUS11726373B2Semiconductor device and display device
Publication Date: 2023.08.15 SEMICON ENERGY LAB CO LTD
  • US11726373B2 patent drawing
  • US11726373B2 patent drawing
  • US11726373B2 patent drawing

AI summary

An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.