High-Frequency Signal Line Segmentation for Laminate Packing
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Solution Overview
Problem
Conventional high-frequency signal lines with bent configurations have increased manufacturing costs due to reduced efficiency in packing multiple signal lines on a mother laminate, resulting in fewer signal lines produced from a single laminate and higher costs.
Innovation Solution
The design of high-frequency signal lines is optimized by dividing them into multiple linear signal line portions that can be joined to form a bent configuration, allowing for closer packing on a mother laminate and reducing manufacturing costs through efficient use of materials and simplified assembly processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If bent signal lines are arranged on the mother laminate, then the signal line configuration is optimized for circuit board layout, but the gap between adjacent signal lines increases and the number of signal lines obtained from a single mother laminate decreases
Solution Approach 1:
The bent signal line is divided into multiple linear segments (first signal line portion, second signal line portion, third signal line portion) that are arranged linearly on the mother laminate. This segmentation allows for compact packing while maintaining the bent configuration functionality, thereby increasing the number of signal lines that can be obtained from a single mother laminate.
2Ease of operation
If bent signal lines are arranged on the mother laminate, then the signal line configuration is optimized for circuit board layout, but the manufacturing cost increases
Solution Approach 1:
The bent signal line is divided into multiple linear segments that can be arranged in a compact matrix pattern on the mother laminate. This segmentation enables more efficient use of the mother laminate area, increasing production yield and reducing the manufacturing cost per signal line while still providing the required bent configuration for circuit board layout optimization.
3Productivity
If linear signal lines are arranged on the mother laminate, then the number of signal lines obtained from a single mother laminate increases, but the signal line configuration is not optimized for circuit board layout
Solution Approach 1:
The signal line is segmented into multiple linear portions (first, second, and third signal line portions) that are connected in sequence on the mother laminate. These linear segments can be compactly arranged to maximize the number of signal lines per mother laminate, while the connected segments form the required bent configuration for optimal circuit board layout.
Data Source
AI summary
In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.