Interspaced Pin Columns Contain Conductive Particles
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Solution Overview
Problem
Anisotropic conductive films used in pin connections for electronic products face issues with short circuits due to conductive particles being extruded between adjacent pin structures during heating and pressurization, leading to horizontal conduction where it is not intended.
Innovation Solution
The pin structure incorporates interspaced columns to contain conductive particles when laminating with an anisotropic conductive film, reducing the number of particles that flow between adjacent pin structures and preventing short circuits, while ensuring vertical conduction between corresponding pin structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an anisotropic conductive film is used to connect pin structures, then vertical conduction between pin structures is achieved, but conductive particles are extruded into gaps between horizontally adjacent pin structures causing short circuits
Solution Approach 1:
The pin structure is divided into multiple columns within each pin, creating internal spacing that segments the conductive particle flow path. This segmentation prevents conductive particles from freely moving between horizontally adjacent pins, thereby reducing short circuit risk while maintaining vertical conduction capability
Solution Approach 2:
The columns within each pin structure have different properties: they are conductive in the vertical direction (for signal transmission) but create horizontal spacing (for particle containment). This local quality differentiation allows the same structure to simultaneously achieve vertical conduction and horizontal particle containment
2Manufacturing precision
If the distance between connecting conductive circuit and pin structures is small, then connection precision is improved, but conductive particles are more easily extruded causing short circuits
Solution Approach 1:
By segmenting each pin into multiple columns with internal spacing, the structure creates localized containment zones for conductive particles. This allows small overall distances between pins (maintaining connection precision) while preventing particle extrusion through the column spacing mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the incidence of short circuits and maintains vertical conductivity between pin structures, improving the reliability and flatness of the pin connection structure, suitable for applications where high-temperature Pb-Sn welding is not feasible.
Implementation Method 1
An anisotropic conductive film (ACF) is formed by evenly distributing a large amount of micro-conductive particles over the interior of an insulating adhesive material, and then making a plurality of conductive particles produce a conductive effect only in a compressive direction and not produce any conductive effect in a non-compressive direction through a heating and pressurizing process.
Implementation Method 2
through a heating and pressurizing process
Implementation Method 3
through a heating and pressurizing process
Data Source
AI summary
The present disclosure relates to a conductive connection structure, and more particularly to a pin structure and pin connection structure thereof. The pin structure is disposed at least one side of an anisotropic conductive film. A plurality of conductive particles is distributed over the interior of the anisotropic conductive film. The pin structure comprises: a plurality of columns which are interspaced, wherein, the conductive particles are in the periphery of the columns. The pin structure and pin connection structure provided by the present disclosure use a pin structure comprising a plurality of columns which are interspaced. When the anisotropic conductive film is used to laminate pin structures, spacing between adjacent columns can contain the conductive particles so as to reduce the number of conductive particle that flow between the left-and-right adjacent pin structures, thereby reducing incidence of short circuit of the left-and-right adjacent pin structures.