Sintered Contact Element for Power Semiconductor Modules
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Solution Overview
Problem
The existing methods for assembling power semiconductor modules with external electronic components are complex and costly, particularly due to the need for soldering, which requires additional cleaning and washing steps, and obstructs the operation of bonding machines.
Innovation Solution
A contact element formed by a sintered contact part and a separate contact pin, connected via a press-fit or screw fitting, allowing for a stable mechanical and electrical connection without soldering, enabling simultaneous sintering with chip fixation and standard assembly machine usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is used to connect contact elements to circuit carriers, then reliable electrical connection is achieved, but additional cleaning and washing steps are required and bonding machine operation is obstructed
Solution Approach 1:
The contact element is divided into two separate parts: a contact pin and a contact carrier. The contact carrier is connected to the circuit carrier via sintering, while the contact pin is attached to the contact carrier through mechanical press-fit or screw connection. This segmentation eliminates the need for soldering the entire contact element, thereby removing the requirement for cleaning and washing steps while maintaining reliable electrical connection.
Solution Approach 2:
The soldering process is replaced with a combination of sintering (for the contact carrier to circuit carrier connection) and mechanical fastening methods (press-fit or screw connection for the contact pin). This substitution eliminates the harmful effects of soldering flux and residue, removing the need for subsequent cleaning operations.
2Reliability
If soldering is used to assemble contact elements, then stable electrical connection is achieved, but cleaning and washing steps are required increasing production time and cost
Solution Approach 1:
By segmenting the contact element into a contact pin and contact carrier, the invention enables parallel processing: the contact carrier can be sintered to the circuit carrier while the contact pin is prepared separately and then mechanically attached. This eliminates the sequential dependency imposed by soldering, thereby increasing assembly efficiency and productivity.
Solution Approach 2:
Replacing soldering with sintering and mechanical fastening eliminates the time-consuming cleaning and washing steps that are mandatory after soldering. The sintering process creates a stable connection without flux residue, and the mechanical attachment of the contact pin can be performed without additional cleaning operations, thus streamlining the production process.
3Ease of manufacture
If conventional contact elements are used, then assembly is possible, but specialized equipment is required and pin configuration flexibility is limited
Solution Approach 1:
The separation of the contact pin from the contact carrier allows for independent design and configuration of the pin structures. Different pin types, lengths, and arrangements can be implemented by simply changing the contact pin components without affecting the contact carrier or requiring specialized assembly equipment, thereby enhancing adaptability and versatility.
Solution Approach 2:
The contact carrier serves as a universal base that can accommodate various types of contact pins through standardized mechanical attachment methods (press-fit or screw connections). This universal design enables the same contact carrier structure to support different pin configurations for various applications without requiring specialized equipment or complex retooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the assembly process, reduces costs, and provides a more reliable and stable connection, eliminating the need for cleaning steps and allowing for varied pin configurations without specialized equipment.
Implementation Method 1
A contact element formed by a sintered contact part and a separate contact pin, connected via a press-fit or screw fitting
Data Source
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AI summary
The present invention relates to a contact element for a power semiconductor module having a circuit carrier and at least one power semiconductor element. In particular, the present invention relates to such a power semiconductor module having an improved contact element for contacting an external electronic component. The present invention further relates to a method for fabricating such a power semiconductor module. Said contact element (100) comprises a sintered contact part (106, 134) being sintered to the circuit carrier (102) thereby being electrically connected to a conductive lead, and at least one contact pin (108) for contacting the external electronic component, said contact pin (108) being connected to the sintered contact part (106, 134) by means of a force-fit and/or form-fit connection.