Microelectronic Chip Crimping Bead Fabric Integration
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Solution Overview
Problem
Existing methods for integrating microelectronic chip devices into fabrics are cumbersome due to the need for secure attachment to threads, which complicates the weaving process and can lead to damage.
Innovation Solution
A microelectronic chip device with a protruding element that forms a crimping bead upon deformation, allowing secure integration into a fabric without requiring complex thread attachment, using thermodeformable materials and axial compression to ensure electrical contact with conductive threads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid mechanical supports are used to connect microelectronic chips, then mechanical strength and electrical connection reliability are improved, but adaptability to flexible structures and ease of integration into fabrics deteriorate
Solution Approach 1:
The patent replaces rigid mechanical supports with flexible thread elements that can be woven into fabric structures. The thread elements maintain electrical connection reliability while providing the flexibility needed for integration into wearable and flexible electronic applications.
Solution Approach 2:
The patent substitutes traditional rigid mechanical connection systems with a textile-based weaving system. Instead of rigid supports requiring complex assembly, the invention uses flexible threads that can be integrated into fabric through standard weaving processes, dramatically improving ease of manufacture and adaptability.
2Strength
If complex secure attachment methods are used to fix chips to threads, then mechanical hold strength is improved, but device complexity and ease of manufacture worsen
Solution Approach 1:
The chip device incorporates integrated attachment structures that enable self-attachment to the thread elements during the weaving process. The chip includes protrusions or engagement features that automatically secure to the threads without requiring separate attachment steps, reducing complexity while maintaining strong mechanical hold.
Solution Approach 2:
The chip is pre-prepared with attachment structures (such as protrusions, loops, or engagement features) before the weaving process. This preliminary preparation allows the chip to be easily integrated into the fabric during standard weaving operations, eliminating the need for complex post-weaving attachment methods.
3Strength
If complex secure attachment methods are used to fix chips to threads, then mechanical hold strength is improved, but productivity and ease of manufacture deteriorate
Solution Approach 1:
The chip device incorporates integrated attachment structures that enable self-attachment to the thread elements during the weaving process. The chip includes protrusions or engagement features that automatically secure to the threads without requiring separate attachment steps, reducing complexity while maintaining strong mechanical hold.
4Reliability
If traditional chip attachment methods are used, then electrical connection can be established, but the chip device requires careful handling during weaving to avoid damage
Solution Approach 1:
The patent replaces rigid mechanical supports with flexible thread elements that can be woven into fabric structures. The thread elements maintain electrical connection reliability while providing the flexibility needed for integration into wearable and flexible electronic applications.
Solution Approach 2:
The chip device incorporates integrated attachment structures that enable self-attachment to the thread elements during the weaving process. The chip includes protrusions or engagement features that automatically secure to the threads without requiring separate attachment steps, reducing complexity while maintaining strong mechanical hold.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy incorporation of microelectronic chip devices into fabrics without the need for secure thread attachment, enhancing the reliability and simplicity of the integration process while maintaining electrical connectivity.
Implementation Method 1
deforming the protruding element at its free end so as to form a crimping bead
Implementation Method 2
one of the plates is placed in contact with the free end of the protruding element, or in contact with a fabric face separated from the free end by a portion of fabric, in order to heat said free end during the deformation step
Implementation Method 3
The other plate can be placed in contact with the base on a face of the base opposite the face of the base from which rises the protruding element, this other plate being cooled during the deformation step
Implementation Method 4
the fabric comprises an electrically conductive thread, said electrically conductive thread being brought into electrical contact with the connection terminal upon the insertion of the chip device into the fabric
Data Source
AI summary
The method for assembling a microelectronic chip device (101) in a fabric (104) comprises the following steps: providing a microelectronic chip device (101) comprising a base (102) and a protruding element (103) rising from a face of the base (102), said protruding element (103) comprising a free end opposite the base (102); inserting into the fabric (104) the chip device (101) by the free end of the protruding element; deforming the protruding element (105) at its free end so as to ensure the securing of the chip device (101) with the fabric (104) by forming a crimping bead (106).