Leadframe Flanges for Semiconductor Attachment
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Solution Overview
Problem
Existing semiconductor device packaging technologies face issues with glue cracking and delamination during handling and stress testing due to insufficient attachment surface area, leading to device failure.
Innovation Solution
A leadframe structure with flanges and recessed regions is used to increase the attachment surface area for electronic components, employing an adhesive layer to secure the components between the flanges and leadframe elements, thereby enhancing attachment reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional leadframe structure without flanges is used, then the device complexity is low, but the attachment surface area is insufficient leading to glue cracking and delamination
Solution Approach 1:
The leadframe is segmented into multiple elements including first and second leadframe elements, with flanges extending from outer edges. This segmentation creates distinct attachment zones that increase the overall attachment surface area while maintaining structural integrity, preventing glue cracking and delamination without excessive complexity
Solution Approach 2:
Flanges are added extending perpendicular from the plane of the leadframe elements, utilizing the vertical dimension to create additional attachment surface area. This dimensional extension provides more glue bonding area without significantly increasing the footprint, thereby improving reliability while controlling complexity
2Strength
If the attachment surface area is increased using flanges and recessed regions, then the resistance to cracking and delamination improves, but the manufacturing complexity increases
Solution Approach 1:
Recessed regions are pre-formed in the leadframe elements before component assembly. These recesses are created during leadframe fabrication, allowing the adhesive to be contained and distributed more effectively during the subsequent bonding process, thereby strengthening the attachment without requiring complex post-processing steps
Solution Approach 2:
The leadframe structure incorporates localized features (flanges at specific outer edges, recessed regions at specific locations) that concentrate attachment strength where needed. This local enhancement of attachment quality provides targeted strength improvement without requiring complex modifications across the entire leadframe structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased attachment surface area effectively resists cracking and delamination, improving quality control and reliability of packaged semiconductor devices under handling vibrations and stress testing.
Implementation Method 1
The electronic component is coupled to the first and second surfaces of the first and second leadframe elements by an adhesive layer
Data Source
AI summary
A device includes a leadframe and an electronic component. The leadframe includes a first leadframe element having a first surface and a second leadframe element adjacent to the first leadframe element, the first and second leadframe elements being separate from one another, the second leadframe element having a second surface. A first flange extends from a first outer edge of the first leadframe element and extends away from the first surface of the first leadframe element. A second flange extends from a second outer edge of the second leadframe element and extends away from the second surface of the second leadframe element. The electronic component is coupled to the first and second surfaces of the first and second leadframe elements such that the first and second flanges are located at opposing first and second sidewalls of the electronic component.