Electronic Component Embedded Board Yield via Pre-Tested Substrates
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Solution Overview
Problem
The yield of electronic component embedded boards is reduced due to malfunctions such as via opening or short-circuiting in the multilayered wiring structure, even when there is no issue with the electric connection between the electronic component and the substrate.
Innovation Solution
The solution involves creating a first and second substrate with multilayered wiring structures, conducting an electric test to ensure they are non-defective, and then embedding the electronic component between them, with a photosensitive resin or other types of resin being used to seal and bond the substrates, ensuring accurate sealing and improved yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the multilayered wiring structure is formed after the electronic component is connected to the substrate, then the manufacturing process is simplified, but the yield is reduced due to potential malfunctions in the wiring and vias
Solution Approach 1:
The patent applies preliminary action by forming the multilayered wiring structure on both substrates before the electronic component connection step. This allows the wiring and vias to be completed in advance, enabling pre-testing of electrical connections and reducing the risk of defects during subsequent assembly operations.
Solution Approach 2:
The patent segments the manufacturing process into distinct phases: forming multilayered wiring structures on separate substrates, testing them independently, and then assembling them with the electronic component. This segmentation allows for independent optimization and quality control of each subsystem before integration.
2Ease of manufacture
If the space between substrates is not accurately sealed, then the manufacturing process is simpler, but the reliability and protection of the electronic component is reduced
Solution Approach 1:
The patent utilizes parameter changes by employing a photosensitive resin that undergoes chemical transformation upon exposure to light. The resin transitions from a liquid or paste state to a solidified sealed structure, providing accurate sealing of the space between substrates while protecting the electronic component from environmental factors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the yield of electronic component embedded boards by ensuring the substrates and electronic components are non-defective before assembly and accurately sealing the space between the substrates, reducing the occurrence of malfunctions and enhancing the reliability of the board.
Implementation Method 1
a resin arranged between the first substrate and the second substrate, and sealing the electronic component and bonding the first substrate and the second substrate to each other. The resin may be a photosensitive resin having adhesion
Implementation Method 2
a photosensitive resin having adhesion between the first and the second substrate, the space between the first and the second substrates can be accurately sealed
Data Source
AI summary
A second substrate 12 is provided above a first substrate 11, and an electronic component 13 is arranged between the first substrate 11 and the second substrate 12 so that between the first substrate 11 and the second substrate 12, the electronic component 13 is sealed and a photosensitive resin 14 having adhesion is provided to bond the first substrate 11 and the second substrate 12 to each other.