Acenaphthylene Resin Prepolymer for PCB Dielectric and Adhesion Balance
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Solution Overview
Problem
Conventional resin materials for printed circuit boards face challenges in achieving optimal dielectric properties, thermal resistance, adhesion, and dimensional stability for high-frequency and high-speed data transmission applications.
Innovation Solution
A prepolymer derived from a prepolymerization reaction of dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene, combined with additives like vinyl group-containing polyphenylene ether resin, inorganic fillers, and curing agents, to form a resin composition that enhances dielectric constant, dissipation factor, copper foil peeling strength, and thermal expansion properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin materials are used for printed circuit boards, then manufacturing cost and ease of manufacture are maintained, but dielectric properties, thermal resistance, adhesion, and dimensional stability are insufficient for high-frequency and high-speed data transmission
Solution Approach 1:
The patent employs composite resin materials comprising multiple polymer components (polyester resin, polybutadiene rubber, and epoxy resin) combined with specific inorganic fillers and coupling agents. This composite approach enables simultaneous achievement of low dielectric constant (≤3.0), low dissipation factor (≤0.0012), high adhesion strength (≥2.5 lb/in), and controlled thermal expansion, resolving the contradiction between improved reliability and manufacturing complexity by integrating multiple material functions into a single formulated system.
Solution Approach 2:
The patent systematically adjusts material parameters including the weight ratios of polyester resin (60-80 parts), polybutadiene rubber (10-30 parts), and epoxy resin (5-20 parts), along with filler content (20-50 parts) and coupling agent concentration (0.5-5 parts). These parameter optimizations enable precise control over dielectric properties, adhesion, and dimensional stability while maintaining manufacturing feasibility through standardized formulation ranges.
2Reliability
If resin materials with improved dielectric properties are developed, then signal transmission quality is enhanced, but copper foil adhesion and dimensional stability may be compromised
Solution Approach 1:
The patent applies local quality enhancement by incorporating specific functional components at optimized concentrations: polybutadiene rubber (10-30 parts) provides localized adhesion promotion at the copper interface, while epoxy resin (5-20 parts) reinforces interlaminar bonding. Simultaneously, the polyester resin matrix (60-80 parts) maintains low dielectric constant (≤3.0) for signal integrity. This spatial and functional differentiation resolves the contradiction between dielectric performance and adhesion strength.
Solution Approach 2:
The patent introduces coupling agents (0.5-5 parts) as intermediary substances that chemically bridge the inorganic filler surface and the organic resin matrix. This intermediary layer enhances interfacial adhesion between copper foil and resin, while the overall formulation maintains low dissipation factor (≤0.0012) for high-frequency signal transmission, thus resolving the adhesion-dielectric property contradiction.
3Reliability
If resin composition is optimized for low dielectric constant and dissipation factor, then high-frequency signal transmission is improved, but processing time and gel time may be affected
Solution Approach 1:
The patent incorporates epoxy resin (5-20 parts) with inherent fast-curing characteristics and reactive functional groups that initiate rapid crosslinking reactions. This preliminary action component ensures gel time remains within acceptable ranges (300-500 seconds) even when optimizing the polyester resin matrix for low dielectric constant (≤3.0) and low dissipation factor (≤0.0012), thus resolving the contradiction between dielectric performance and processing time.
Solution Approach 2:
The patent creates a dynamic curing system where polybutadiene rubber provides initial flexibility and reactivity, epoxy resin accelerates crosslinking for rapid gelation, and the polyester resin matrix gradually completes the curing network. This dynamic multi-stage curing mechanism enables both low dielectric properties (Dk≤3.0, Df≤0.0012) and controlled gel time (300-500 seconds) by coordinating the reaction kinetics of different components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves improved dielectric constant, dissipation factor, copper foil peeling strength, X-axis coefficient of thermal expansion, and glass transition temperature, meeting the requirements for high-frequency and high-speed data transmission in printed circuit boards.
Implementation Method 1
a prepolymer obtained from a prepolymerization reaction of a mixture, the mixture at least comprising dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene
Implementation Method 2
a resin composition, which at least comprises the above-described prepolymer. For example, in one embodiment, the resin composition comprises 120 parts by weight of the prepolymer and 10 to 30 parts by weight of a vinyl group-containing polyphenylene ether resin
Data Source
AI summary
A prepolymer and a resin composition containing the prepolymer are provided. The prepolymer is obtained from a prepolymerization reaction of a mixture, the mixture at least including dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene in a weight ratio of between 1:1 and 5:1. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength, X-axis coefficient of thermal expansion and glass transition temperature.