Electrical Equipment TRIZ Cases

Dual adhesive layers with different elastic moduli help curved cover glass resist springback and stay bonded to the frame in onboard displays.

By laminating display and touch films between two glass panels, this case protects fragile layers while enabling full-area capacitive interaction.

A multilayer aerogel sheet blocks heat spread between lithium battery cells while absorbing expansion pressure to improve module stability.

A layered aerogel insulation sheet slows heat transfer between lithium battery cells while absorbing pressure to improve module safety.

Alternating high- and low-index nano layers boost HUD image reflectivity while lowering non-display reflections that distract drivers.

A multilayer guard plate with a thicker upper skin and fiber-reinforced interlayer cuts cost and weight while dispersing impact to protect battery cells.

A thicker upper skin and composite interlayer disperse impact loads, reducing deformation, weight, and cost in battery bottom guard plates.

A maleimide-vinyl aromatic resin composition keeps dielectric constant and loss low after moisture absorption while preserving metal foil peel strength.

A resin-metal-resin battery bottom plate removes steel punching and coating steps while improving corrosion resistance, impact protection, and consistency.

Low-modulus adhesive layers create split neutral planes in curved OLED displays, reducing bending strain and improving long-panel reliability.

A controlled compressive and central tension profile lets curved interior glass resist breakage and fragmentation in headform impacts.

A recessed thin region with a flat bottom and stepped transition helps glass bend for vehicle displays while limiting stress concentration and breakage.

A peroxide- and acid-free hot melt encapsulant film blends propylene and ethylene polymers to balance adhesion, heat resistance, and PV module stability.

Mirror and rough quartz cavity surfaces with a B-staged metal adhesive improve bonding, heat resistance, and UV durability in optical packages.

A layered battery tab sealant balances pressure release under heat with stable terminal and packaging adhesion during production.

A controlled crosslinking rate in ethylene-unsaturated ester resin helps laminated glass and solar encapsulants balance clarity and moisture-resistant adhesion.

Cold-bent cover glass and matched-radius lamination enable curved vehicle displays without hot-forming distortion, surface marks, or added cost.

A silane-coupled adhesive layer helps fuel cell seals resist acid, water, and heat while preserving long-term bonding reliability.

A tailored compressive and central tension stress profile helps curved automotive interior glass resist headform impact and reduce fragmentation.

A mirror-top, rough-side quartz cavity improves UV-LED light extraction while resisting heat and short-wavelength UV degradation.

Controlled tempering, etching, and bonding load keep copper hard while raising laminate peel strength for thin electronic heat-radiation members.

A dual-grain copper layer improves thermal fatigue resistance at the ceramic interface while preserving surface hardness and homogeneity.

A dual-grain copper layer improves thermal shock resistance at the ceramic interface while preserving hardness, machinability, and wire bonding quality.

A PPE-based resin blend without epoxy improves high-frequency PCB dielectric loss, thermal aging stability, copper peel strength, and alkali resistance.

A low-permeability silicon oxide layer in a multilayer anti-reflective film blocks moisture ingress and keeps display transmittance stable.

A diffusion layer plus multilayer dielectric coating cuts surface reflectance and glare while preserving image clarity and durability.

Wrapped PI protection around thinned ultra-thin glass edges improves impact resistance, bending reliability, and edge chipping control.

Blunted glass edges, compressive stress regions, and a thin polymer layer enable tighter folding while improving impact and puncture resistance.

A nested heat dissipation member and adhesive stack cool the display driving IC while preserving thin curved panel structure and bonding reliability.

Internal compressive stress regions in glass cover components deflect cracks under impact, improving drop durability in electronic devices.

A silane-modified olefin adhesive boosts bonding and peel strength between low-roughness conductive and dielectric PCB layers.

A multi-component PPE resin balances low dielectric loss with low thermal expansion and adhesion for reliable high-frequency wiring boards.

A metal foam cushion plate combines heat dissipation and shock absorption, cutting display thickness, bezel area, and layer separation.

A polyimide-maleimide adhesive layer bonds smooth copper foil to resin substrates, cutting high-frequency loss while preventing circuit peeling.

Blunted glass edges and a thin polymer interlayer cut interface stress, enabling tighter folding with better impact and puncture resistance.

Nano-sized silica particles on metal foil boost bonding to insulating layers without added adhesives, helping prevent peeling and dielectric loss.

Using p-polarized HUD light and a silver-dielectric windscreen coating, this case removes ghost images while preserving transmission and heating.

A crosslinked vinyl aromatic resin system improves metal-layer adhesion, Tg, thermal expansion, and dielectric loss for high-frequency laminates.

Hydrophilic fumed silica and silane crosslinking raise encapsulant film resistivity to improve PID resistance and limit PV module power loss.

A prepolymer made from dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene targets PCB dielectric behavior, copper adhesion, and thermal stability.

Simultaneous thermal forming, phase separation, and etching create shaped glass laminates with over 98% transmittance and under 1% reflectance.

Dovetail grooves let the casing plate hang during inorganic coating, avoiding clamps and edge cutting for continuous coverage and rust prevention.

Reactive surface bonds join high-void particles to the matrix resin, reducing water ingress and dielectric loss in printed substrates.

H12-MDI shortages motivate an IPDI-based TPU that preserves transparency, elasticity, and light stability for films and protective applications.

Smooth copper foil lowers conductor loss but can weaken adhesion; a dimer-acid-derived maleimide thermosetting layer supports bonding and dielectric performance.

Hydrophilic fumed silica and crosslinking agents raise encapsulant film resistivity to improve PID resistance and limit PV module power loss.