Adhesive Composition for Low-Roughness PCB Laminate Bonding
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Solution Overview
Problem
Existing adhesive compositions fail to adequately address the issue of insufficient adhesion strength between low-roughness conductive layers and dielectric layers in laminates, leading to reduced reliability and performance in printed circuit boards.
Innovation Solution
An adhesive composition comprising a polycyclic aromatic hydrocarbon compound, a specific olefin copolymer, and a silane coupling agent, formulated in specific ratios, to enhance adhesion strength and peeling strength while maintaining dielectric properties and thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If low-roughness metal foil is used as the conductive layer, then the printed circuit board achieves thinness and improved electrical properties, but the adhesion strength between the conductive layer and dielectric layer deteriorates
Solution Approach 1:
The patent introduces an adhesive composition as an intermediary layer between the low-roughness conductive layer and the dielectric layer. This adhesive composition contains specific polymers and coupling agents that chemically bond to both surfaces, mediating the adhesion problem without requiring changes to the conductive layer's low-roughness surface that would compromise electrical performance.
Solution Approach 2:
The adhesive composition itself is a composite material combining multiple components (polymer base resin, reactive diluent, coupling agent, catalyst) that work together to provide both adhesion to the low-roughness metal surface and bonding to the dielectric layer, while maintaining flexibility and electrical properties.
2Reliability
If the adhesion strength between conductive layer and dielectric layer is improved through conventional adhesive compositions, then the reliability is enhanced, but the peeling strength and aging resistance remain insufficient
Solution Approach 1:
The patent modifies the chemical and physical parameters of the adhesive system by selecting specific polymers with appropriate molecular weights, glass transition temperatures, and functional groups. The coupling agent concentration and curing conditions are also optimized to achieve maximum peeling strength and aging resistance while maintaining laminate reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition improves adhesion strength and peeling strength of laminates, ensuring reliability and performance in thin, high-frequency/high-speed printed circuit boards without compromising dielectric or thermal properties.
Implementation Method 1
a silane coupling agent
Implementation Method 2
The adhesive composition comprises... a silane coupling agent
Implementation Method 3
enhance adhesion strength between the conductive layer and the dielectric layer
Implementation Method 4
improving the peeling strength and aging resistance... without adversely affecting its dielectric properties, thermal resistance or dimensional stability
Data Source
AI summary
An adhesive composition is provided. The adhesive composition includes (A) a polycyclic aromatic hydrocarbon compound, (B) an olefin copolymer, and (C) a silane coupling agent. The component (B) includes the repeating units represented by the following formulas (I) to (III), and the content of the repeating unit (B-2) ranges from 1 mol % to less than 100 mol %.R1 to R21, m, n, o, and p are as defined in the specification. Based on the total weight of the component (A), component (B) and component (C), the amount of the component (A) ranges from 33 wt % to 64 wt %, the amount of the component (B) ranges from 35 wt % to 66 wt %, and the amount of the component (C) ranges from 0.1 wt % to 4.0 wt %.