PV Module Encapsulant Film with Hydrophilic Fumed Silica for PID Resistance
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Solution Overview
Problem
Existing encapsulant materials for photovoltaic modules, such as ethylene vinyl acetate (EVA) and olefin-based materials, suffer from low volume resistivity, leading to potential induced degradation (PID) and significant module power loss.
Innovation Solution
A composition comprising an olefin-based polymer with a volume resistivity greater than 5.0*1015 ohm·cm, hydrophilic fumed silica, alkoxysilane, organic peroxide, and optionally a crosslinking co-agent, which results in a film layer with a volume resistivity from 5.0*1017 ohm·cm to 6.0*1018 ohm·cm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If EVA or conventional olefin-based encapsulant materials are used, then the encapsulant provides transparency, flexibility, and ease of conversion into crosslinkable sheet, but the volume resistivity is low resulting in poor PID resistance and significant module power loss
Solution Approach 1:
The patent creates a composite encapsulant material by combining olefin-based polymer with hydrophilic fumed silica and crosslinking agents. This composite structure achieves volume resistivity greater than 10^17 ohm·cm while maintaining the required transparency, flexibility, and crosslinkability, thereby resolving the contradiction between ease of manufacture and PID resistance.
Solution Approach 2:
The patent modifies the chemical and physical parameters of the encapsulant material by incorporating specific amounts of hydrophilic fumed silica (0.1-5 wt%) and using crosslinking agents to achieve volume resistivity >10^17 ohm·cm. This parameter change transforms conventional olefin-based materials with insufficient VR into high-VR encapsulants that prevent PID while retaining processability.
2Ease of manufacture
If olefin-based encapsulating materials with lower volume resistivity are used, then the material offers excellent transparency, heat resistance, and ease of conversion into crosslinkable film, but the PID-preventing performance is insufficient
Solution Approach 1:
The patent incorporates crosslinking agents and hydrophilic fumed silica into the olefin-based polymer matrix before film formation. This preliminary incorporation ensures that when the film is converted and crosslinked, it achieves the required volume resistivity >10^17 ohm·cm for PID prevention while maintaining the ease of film conversion process.
Solution Approach 2:
The patent changes the chemical composition parameters by adding hydrophilic fumed silica (0.1-5 wt%) and crosslinking agents to the olefin-based polymer. These parameter modifications enable the material to achieve both ease of manufacture (crosslinkable film formation) and high reliability (PID resistance with VR >10^17 ohm·cm).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances the volume resistivity of the encapsulant film, improving PID resistance and reducing power loss in photovoltaic modules.
Implementation Method 1
an organic peroxide; and (E) from 0 wt % to 1.5 wt % of a crosslinking co-agent
Implementation Method 2
an organic peroxide
Implementation Method 3
a hydrophilic fumed silica; wherein the film layer has a volume resistivity from 5.0*10^17 ohm·cm to 6.0*10^18 ohm·cm
Data Source
AI summary
A composition for use as a film layer comprises (A) an olefin-based polymer having a volume resistivity greater than 5.0*1015 ohm·cm; (B) a hydrophilic fumed silica; (C) an alkoxysilane; (D) an organic peroxide; and, optionally, (E) from 0 wt % to 1.5 wt % of a crosslinking co-agent.