Crosslinked Resin Composition for Low-Loss Metal-Clad Laminates
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Solution Overview
Problem
Existing resin compositions based on polyfunctional vinyl aromatic copolymers suffer from poor adhesion to metal layers, low glass transition temperature, high thermal expansion, and high dielectric loss, which are unsuitable for high-frequency applications and reflow soldering processes.
Innovation Solution
A resin composition comprising a polyfunctional vinyl aromatic copolymer and a compound with a specific structure, such as a bismaleimide derivative, along with optional components like polyphenylene ether resin and diene compounds, to enhance adhesion, thermal stability, and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polyfunctional vinyl aromatic copolymer is used to achieve acceptable dielectric properties for high-frequency applications, then the dielectric constant and loss factor are improved, but the adhesion to metal layer deteriorates
Solution Approach 1:
The patent uses a composite resin composition combining polyfunctional vinyl aromatic copolymer with polyphenylene ether and specific crosslinking agents. This composite approach allows the system to achieve both acceptable dielectric properties from the vinyl aromatic copolymer and improved adhesion to metal layers through the polyphenylene ether component and crosslinking mechanisms.
2Reliability
If a polyfunctional vinyl aromatic copolymer is used to achieve acceptable dielectric properties, then the dielectric loss factor is improved, but the glass transition temperature deteriorates
Solution Approach 1:
The patent modifies the thermal and mechanical properties by introducing polyphenylene ether and crosslinking agents that increase the glass transition temperature. The crosslinking reaction creates a three-dimensional network structure that raises the Tg while the polyphenylene ether component maintains acceptable dielectric loss factor through its molecular structure and intermolecular forces.
3Reliability
If a polyfunctional vinyl aromatic copolymer is used to achieve acceptable dielectric properties, then the dielectric constant is improved, but the coefficient of thermal expansion deteriorates
Solution Approach 1:
The composite resin system combines polyfunctional vinyl aromatic copolymer with polyphenylene ether and crosslinking agents. The polyphenylene ether component has lower thermal expansion characteristics that compensate for the higher CTE of the vinyl aromatic copolymer, achieving overall thermal stability while maintaining acceptable dielectric constant through the copolymer's molecular structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high glass transition temperature, low thermal expansion, low dielectric constant and loss factor, excellent aging resistance, and improved adhesion to metal layers, suitable for high-frequency applications and reflow soldering.
Implementation Method 1
The polyfunctional vinyl aromatic copolymer is obtained by performing a polymerization reaction of 20 mol % to 100 mol % of a divinyl aromatic compound with other optional monomers
Implementation Method 2
the dielectric material must have a high heat resistance and must have a high glass transition temperature
Data Source
AI summary
A resin composition and uses thereof are provided. The resin composition includes:(A) a polyfunctional vinyl aromatic copolymer; and(B) a compound having a structure of formula (I),wherein the polyfunctional vinyl aromatic copolymer (A) is prepared by copolymerizing one or more divinyl aromatic compounds with one or more monovinyl aromatic compounds, and in formula (I), Y1 is an organic group.