Light Source Module ACF Mounting Thermal Management
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Solution Overview
Problem
The optical properties of light-emitting diodes (LEDs) used in light source modules for display devices are prone to changes due to heat generated during the mounting process, leading to luminosity and color coordinate disparities in pixels, which can result in color differences in the display panel.
Innovation Solution
A light source module is designed with a mounting substrate featuring exposed metal lines, an anisotropic conductive film (ACF) that electrically connects the LEDs to the substrate, and a heat sink member to manage thermal issues, ensuring the LEDs' optical properties remain stable during the mounting process by using a thermoplastic adhesive and conductive particles dispersed in the insulation body, and a release film to prevent foreign substances from interfering with the LED placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional mounting methods are used to attach LEDs to the substrate, then the mounting process can be completed, but heat is generated during the process which changes the optical properties of the LEDs
Solution Approach 1:
The patent introduces an anisotropic conductive film (ACF) as an intermediary layer between the LED and the substrate. This ACF serves multiple functions: it provides thermal isolation to prevent heat transfer to the LED during mounting, ensures electrical connection through its conductive particles, and maintains mechanical stability. By placing this intermediary material between the mounting process and the LED, the harmful thermal effects are blocked while still enabling the mounting operation to proceed.
Solution Approach 2:
The anisotropic conductive film is constructed as a composite material consisting of conductive particles dispersed in an insulating resin matrix. This composite structure allows the film to exhibit both conductive and insulating properties in different directions, enabling electrical connection while providing thermal isolation. The composite nature of the ACF resolves the contradiction by combining materials with complementary properties to achieve both mounting functionality and LED protection.
2Illumination intensity
If multiple LEDs are used to create line or surface light sources, then the light output is improved, but optical property equalization becomes difficult and color differences occur in the display panel
Solution Approach 1:
The patent changes the thermal parameter environment for each LED by providing individual thermal isolation through the ACF. This parameter change prevents heat-induced optical property variations in each LED, allowing multiple LEDs to maintain consistent optical characteristics even when mounted in close proximity. By controlling the thermal parameter at the individual LED level, the patent enables precise optical property equalization across multiple light sources.
3Device complexity
If the LED is directly mounted on the substrate without thermal isolation, then the mounting process is simple, but the LED is exposed to thermal shock which alters luminosity and color coordinates
Solution Approach 1:
The anisotropic conductive film acts as a thermal intermediary that decouples the mounting process from the LED. The ACF absorbs and distributes thermal stress during mounting while preventing direct thermal shock to the LED chip. This intermediary layer adds minimal structural complexity while providing significant thermal protection, thereby maintaining luminosity stability without substantially increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents optical property changes of LEDs during the mounting process, maintaining consistent luminosity and color coordinates, thereby minimizing color differences in the display panel and ensuring reliable image display.
Implementation Method 1
the ACF comprises an insulation body, and a plurality of conductive particles dispersed in the insulation body and insulated from each other, and an insulation of the conductive particles disposed between the two exposed metal lines and the two electrodes of the LED is prevented in at least a first direction
Implementation Method 2
The insulation body may comprise a thermoplastic adhesive
Data Source
AI summary
A light source module includes a mounting substrate including at least two exposed metal lines, a light-emitting diode (LED) including two electrodes disposed corresponding to the at least two exposed metal lines, and an anisotropic conductive film (ACF) provided on the mounting substrate, the ACF electrically connecting the at least two exposed metal lines to the two electrodes, wherein the ACF comprises an insulation body, and a plurality of conductive particles dispersed in the insulation body and insulated from each other, and an insulation of the conductive particles disposed between the two exposed metal lines and the two electrodes of the LED is prevented in at least a first direction.