Printed Circuit Assembling TRIZ Cases
- Rolled Copper Foil Wires for Printed Wiring Board Heat Dissipation
Rolled copper foil wires with high thermal conductivity dissipate heat from components, preventing failures in electronic devices.
- Wiring Board Recesses for 3D Stacking
A wiring board uses recessed openings to nest secondary boards, creating a compact three-dimensional structure.
- Electronic Component Mounting Apparatus Inhibit Period Control
Controller sets inhibit periods to prevent simultaneous thrusting by multiple placing units, avoiding substrate vibration that causes positional shifts.
- Soldering Iron Cleaning via Oxygen-Assisted Combustion
Oxygen supply enables complete combustion of residue at controlled temperatures, preventing thermal damage and oxidization.
- Flexible Printed Circuit Board Structure for Display Devices
Bar-type flexible printed circuit boards connect via soldering portions to conduct electricity without an equipotential board.
- Multi-Layer Ceramic Capacitor Electrode Tin Segmentation
Segmented external electrodes use tin for bonding and tin-free zones to suppress solder spreading, reducing mounting height.
- Universal Clamping Device for Radial and Axial Lead Components
A universal clamping device adapts to radial and axial lead components using adjustable members and a pusher mechanism.
- Sintered Mother Daughter Board Test Fixture
A test fixture uses sintered bonds to join a mother board and daughter board for reliable signal routing.
- Circuit Board Compression for Panel Alignment Accuracy
Segmented compression of circuit board portions to panel pad areas resolves alignment accuracy versus coupling stability trade-offs.
- Terminal Assembly with Selective Solderability Regions
Socket terminal assembly uses a core member within an axial hole to create regions of differing solderability for reliable electrical connections.
- Embedded Magnetic Component Device Isolation Reduction
Adhesive bonding secures magnetic cores in substrate cavities, reducing winding spacing to 0.4 mm while preventing air bubble failures during reflow soldering.
- Light Source Module ACF Mounting Thermal Management
Anisotropic conductive film electrically connects LED electrodes to substrate metal lines while providing thermal insulation during the mounting process.
- Flexible Carrier Adhesive for Electronic Component Integration
Adhesive segments on a flexible carrier fasten electronic components, resolving manufacturing complexity while ensuring reliable electrical connections.
- Flux-less Solder Bonding with Temporary Organic Retainer
A temporary non-reducing organic agent prevents positional displacement during flux-less solder bonding, then evaporates to eliminate cleaning requirements.
- Non-overlapping Contact Holes in Multi-layer Pad Structure
Separating first and second contact holes across insulating layers prevents alignment errors and reduces contact resistance.
- Via-Based Thermal Coupling for PCB Sensor Precision
Thermal coupling through a via hole improves measurement precision and response time without increasing signal interference or space requirements.
- Double-Sided Flexible Circuit Board Layout for Thermal Bonding Flatness
Inner supporting segments with width differences under 8 μm minimize height deviations, resolving flatness issues in double-sided flexible circuit boards.
- Solder Column Exoskeleton Sleeve Prevents Thermal Collapse
Woven copper wire exoskeleton sleeve surrounds solder core to prevent collapse from thermal expansion mismatches in high-power CGA packages.
- Electroless Ni/Pd/Au Plating for Wire Bonding Workability
Optimized electroless plating layers reduce nickel hardness to improve gold wire bonding workability.
- Halogen-Free Circuitized Substrate with Composite Dielectric Layer
Composite dielectric layer combines fiber-reinforced and particulate sub-layers to enable high-density circuit features.