Multi-Layer Ceramic Capacitor Electrode Tin Segmentation

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Solution Overview

Problem

Multi-layer ceramic capacitors face challenges in miniaturization due to increased mounting space requirements and limited functionality caused by the height of the ceramic body and internal electrodes, as well as solder spreading issues during mounting.

Innovation Solution

The design incorporates a ceramic body with external electrodes that include a tin-containing region for reliable solder bonding and a solder-suppressing region free from tin, allowing for efficient solder management and reduced height dimensions, enabling space-saving mounting and enhanced functionality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the external electrode is made entirely of tin-containing material to ensure reliable solder bonding, then the bonding reliability is improved, but the solder spreads upward excessively increasing the mounting space

Engineering Contradiction:
Improvesolder bonding reliabilityVSAvoidmounting space height
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The external electrode is divided into two regions with different material compositions: a first region containing tin for reliable solder bonding, and a second region free from tin to suppress solder spreading. This local differentiation allows each region to perform its specific function optimally.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The external electrode is segmented into functionally distinct regions: a tin-containing first region for bonding and a tin-free second region for solder suppression. This segmentation enables independent optimization of bonding reliability and mounting space.

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If the height of the ceramic main body is increased to accommodate more internal electrodes for high functionality, then the capacitance is improved, but the overall component height increases requiring more mounting space

Engineering Contradiction:
ImprovecapacitanceVSAvoidcomponent height
Core Design Contradiction:
Quantity of substanceVSLength of stationary object

Solution Approach 1:

The internal electrodes are extended in the radial direction to draw out from the side surface of the ceramic main body. This dimensional change allows the electrodes to reach the mounting board without increasing the component height, enabling high capacitance with compact dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The internal electrodes are designed with a drawn-out structure that extends beyond the ceramic body boundaries. This dynamic configuration allows the electrodes to access the mounting surface while maintaining a compact overall component height.

Inventive Principle:
Principle #15Dynamics

3Quantity of substance

If the internal electrodes are drawn out to the end surfaces to increase capacitance and functionality, then the electrical performance is improved, but the structural complexity increases

Engineering Contradiction:
ImprovecapacitanceVSAvoidelectrode structure complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The drawn-out internal electrodes serve multiple functions: they increase the effective electrode area for higher capacitance, provide direct electrical connection to the mounting board, and eliminate the need for separate terminal structures. This multi-functionality reduces overall device complexity despite the extended electrode configuration.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for reliable solder bonding, reduced solder spreading, and increased capacitance, contributing to miniaturization and improved mechanical strength while maintaining the ceramic body's height, thus enhancing the capacitors' performance and reliability.

Implementation Method 1

the solder and the first outermost layer can satisfactorily react with each other in the vicinity of the first main surface, and the solder and the first and second external electrodes can be reliably bonded to each other

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentUS11515095B2Multi-layer ceramic electronic component and circuit board
Publication Date: 2022.11.29 TAIYO YUDEN KK
  • US11515095B2 patent drawing
  • US11515095B2 patent drawing
  • US11515095B2 patent drawing

AI summary

A multi-layer ceramic electronic component includes: a ceramic body including first and second internal electrodes laminated in a first axis direction, first and second main surfaces facing in the first axis direction, and first and second end surfaces facing in a second axis direction orthogonal to the first axis, the first and second internal electrodes being drawn to those end surfaces; a first external electrode covering the first end surface and extending to the first main surface; and a second external electrode covering the second end surface and extending to the first main surface. Each external electrode includes a first region including a first outermost layer mainly containing tin and extending from the end surface to the first main surface, and a second region free from an outermost layer mainly containing tin and disposed adjacent to the first region in the first axis direction on the end surface.