Rolled Copper Foil Wires for Printed Wiring Board Heat Dissipation

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Solution Overview

Problem

Printed wiring boards in electronic devices face heat dissipation challenges due to heat generated by components, leading to potential failures unless effective heat release mechanisms are implemented.

Innovation Solution

Incorporating wires made from rolled copper foil or materials with thermal conductivity of 330 W/(m·K) or more, directly or indirectly connected to heat-generating components, and optionally using extraction wires to enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional wires are used in printed wiring boards, then device complexity is reduced and ease of manufacture is improved, but heat dissipation capability deteriorates leading to component failures

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidwire material specification

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the material parameter of the wire from conventional materials to rolled copper foil with minimum 99.99% purity and specific crystal grain size control (5.0 μm or more), thereby improving thermal conductivity and heat dissipation capability while maintaining compatibility with standard manufacturing processes

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent specifies a composite structure for the wire comprising rolled copper foil with controlled crystal grain size and purity, creating a material that optimizes both electrical conductivity and thermal conductivity for effective heat dissipation from heat-generating components

Inventive Principle:

Principle #40Composite materials

2Reliability

If rolled copper foil with high purity is used in wires, then thermal conductivity is improved for better heat dissipation, but manufacturing precision requirements increase

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidcrystal grain size control

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent establishes specific parameter ranges for crystal grain size (5.0 μm or more) and purity (99.99% or more) of the rolled copper foil, optimizing the balance between heat dissipation performance and manufacturability by defining controllable parameters that can be achieved with standard manufacturing capabilities

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively dissipates heat from heat-generating components, preventing failures and ensuring reliable operation of electronic devices.

Implementation Method 1

the one or more wires include a rolled copper foil, either partly or as a whole... a material having a thermal conductivity of 330 W/(m·K) or more

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10194534B2Printed wiring board, electronic device, catheter, and metallic material

Publication Date: 2019.01.29 JX NIPPON MINING & METALS CORP

AI summary

Provided herein is a printed wiring board that can desirably dissipate the heat of a heat-generating component. The printed wiring board includes one or more wires, and one or more heat-generating components. The one or more wires include a rolled copper foil, either partly or as a whole. The one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.