Wiring Board Recesses for 3D Stacking
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Solution Overview
Problem
Existing multilayer wiring boards face challenges in design flexibility and thickness uniformity due to differences in the number of conductive layers between connected boards, which affects connection reliability and accommodation in mobile devices.
Innovation Solution
A wiring board configuration where a first wiring board with a solder-resist layer has opening portions to accommodate second and third wiring boards, each with a different number of conductive layers, positioned on the same side, connected through conductive bonding layers, enhancing design flexibility and reducing overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple wiring boards with different numbers of conductive layers are connected, then design flexibility is improved, but thickness uniformity deteriorates
Solution Approach 1:
The patent transitions from planar connection to three-dimensional positioning by forming recessed portions in the first wiring board and positioning the second and third wiring boards within these recesses. This allows wiring boards with different thicknesses (different numbers of conductive layers) to be connected while maintaining an uniform external surface, thus resolving the contradiction between design flexibility and thickness uniformity.
2Adaptability or versatility
If wiring boards with different numbers of conductive layers are connected, then design flexibility is improved, but connection reliability deteriorates
Solution Approach 1:
By moving to three-dimensional positioning within recessed portions, the patent enables better alignment and contact between wiring boards with different thicknesses. The recesses provide precise positioning features that ensure reliable electrical connections despite the varying numbers of conductive layers, thus maintaining connection reliability while achieving design flexibility.
3Adaptability or versatility
If wiring boards with different numbers of conductive layers are connected, then design flexibility is improved, but accommodation in mobile devices deteriorates
Solution Approach 1:
The patent embeds the second and third wiring boards within recessed portions of the first wiring board, creating a nested structure. This allows multiple wiring boards with different thicknesses to be accommodated within a compact volume while maintaining an uniform external surface, thus improving accommodation in mobile devices while preserving design flexibility.
Data Source
AI summary
A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.