Via-Based Thermal Coupling for PCB Sensor Precision
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Solution Overview
Problem
Existing thermal monitoring systems for internal combustion engine charging devices require significant space and do not provide precise temperature measurements, limiting their effectiveness and efficiency.
Innovation Solution
A circuit device with a temperature sensor partially penetrating through a via on a printed circuit board to improve thermal coupling with the component, allowing for direct heat absorption and transfer, enhancing dynamic response and precision without interference from other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is placed adjacent to a component on a circuit board, then thermal monitoring is enabled, but the thermal connection is insufficient leading to slow response and imprecise measurements
Solution Approach 1:
The via structure acts as a thermal intermediary between the temperature sensor and the component. By creating a direct thermal pathway through the via holes filled with conductive material, heat is efficiently transferred from the component to the temperature sensor, enabling both precise measurement and rapid response without requiring the sensor to be in direct contact with the component.
Solution Approach 2:
The invention transitions from planar thermal coupling (surface-mounted sensor near component) to three-dimensional thermal coupling by penetrating through the circuit board via holes. This vertical dimension provides a direct thermal pathway that significantly improves heat transfer efficiency compared to lateral heat conduction through the board substrate.
2Measurement precision
If the temperature sensor is thermally coupled to the component, then measurement precision improves, but the component spacing is reduced and signal interference increases
Solution Approach 1:
The via structure serves as a dedicated thermal intermediary that separates the thermal pathway from the electrical signal pathways. The temperature sensor remains electrically isolated from the component while maintaining thermal contact through the via, allowing precise temperature measurement without electrical signal interference or the need for reduced component spacing.
3Area of stationary object
If conventional thermal monitoring arrangements are used, then space requirements are met, but additional space is consumed and installation cost increases
Solution Approach 1:
The via holes serve multiple functions: they provide structural support for the circuit board, enable electrical connections between layers, and simultaneously act as thermal conduction pathways for temperature monitoring. This multi-functionality eliminates the need for separate thermal coupling structures, reducing space requirements and simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables faster reaction times, improved dynamic behavior, and cost savings by allowing components to operate closer to their thermal limits, reducing the need for oversized components and saving space.
Implementation Method 1
the via in which the temperature sensor is thermally connected to the component
Data Source
Figure 1
Figure 2~3
AI summary
A circuit device for thermal monitoring of a component (16), in particular in a charging device (1) for an internal combustion engine, is described, wherein the component (16) is arranged on a first side (20) of a printed circuit board (18) and a temperature sensor (17) is arranged adjacent to the component (16), wherein the temperature sensor (17) is thermally connected to the component (16) via a via (22) which at least partially penetrates the printed circuit board (18) from the first side (20).