Embedded Magnetic Component Device Isolation Reduction
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Solution Overview
Problem
Existing embedded magnetic component devices face challenges in achieving high isolation performance due to limitations in the spacing between primary and secondary windings, which affects device size and safety certifications, and are prone to failures from air bubbles during reflow soldering.
Innovation Solution
A method of manufacturing embedded magnetic component devices with a magnetic core embedded in a cavity within an insulating substrate, where an adhesive is applied to secure the core and form channels to connect cavities, allowing for reduced spacing between windings and improved isolation by forming a solid bonded joint with additional insulating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If epoxy gel is used to fill the cavity to secure the magnetic core, then the magnetic core is firmly fixed, but air bubbles form during solidification causing device failure during reflow soldering
Solution Approach 1:
The patent removes the epoxy gel filling step entirely, extracting the harmful element (air bubbles) from the manufacturing process. Instead of filling the cavity with gel, the magnetic core is secured using adhesive applied to the cavity floor and side walls, eliminating the source of air bubble formation while maintaining core stability.
Solution Approach 2:
The patent introduces adhesive as an intermediary substance between the magnetic core and the cavity structure. This adhesive serves as the mediating agent to secure the core without requiring complete cavity filling, thus preventing air bubble formation while achieving reliable fixation.
2Reliability
If large spacing is maintained between primary and secondary windings to achieve high isolation, then safety certification is obtained, but device size increases
Solution Approach 1:
The patent changes the isolation parameter from 8 mm to 0.4 mm by modifying the bonding method. The solid bonded joint created by eliminating air gaps and using proper adhesive bonding enables this dramatic reduction in isolation distance while maintaining safety certification, thus significantly reducing device size.
Solution Approach 2:
The patent employs composite material bonding (adhesive + solid bonded joint) to achieve high isolation performance at reduced spacing. The combination of adhesive bonding and solid bonded joint creates a reliable insulating barrier that allows smaller spacing between windings while maintaining required isolation levels.
3Reliability
If air gap is maintained around the magnetic core to prevent adhesive contact, then magnetic properties are preserved, but core stability decreases
Solution Approach 1:
The patent applies adhesive locally to the cavity floor and side walls rather than filling the entire cavity. This localized application maintains the air gap around the magnetic core where needed for magnetic performance while providing sufficient adhesive bonding for core stability. The adhesive is applied only where structural support is needed, not where it would interfere with magnetic properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the isolation distance between windings to 0.4 mm, enabling smaller device designs while enhancing reliability and safety compliance, and prevents air bubble-related failures by maintaining an air gap around the magnetic core.
Implementation Method 1
applying adhesive to the cavity floor and to one or more of the channels throughout the row of cavities; installing magnetic cores into the respective cavities so that the magnetic cores are secured in the cavities by the adhesive
Implementation Method 2
applying an insulating layer to the mother base substrate to cover the magnetic cores and the cavities so as to obtain an insulated mother substrate
Implementation Method 3
channels formed between the neighboring cavities in the mother base substrate so as to connect the cavities; applying adhesive to the cavity floor and to one or more of the channels
Data Source
AI summary
In a method of manufacturing a plurality of embedded magnetic component devices, a row of cavities for respective magnetic cores is formed in an insulating substrate. Neighboring cavities are connected to each other by channels formed in the substrate. Adhesive is applied to a cavity floor throughout the row of cavities, and magnetic cores are inserted into the cavities. The cavities and magnetic cores are covered with a first insulating layer. Through holes are formed through the first insulating layer and the insulating substrate, and plated up to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias form the windings for an embedded magnetic component, such as transformer or inductor.